Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Tao Health Life Pharma Co., Ltd.

Satoshi Horie

Tatsuo Sasaoka

Takahiro Yonezawa

Hiroyuki Kiyomura

Tetsuya Tokunaga

Naoki Suzuki

Kazushi Higashi

Yoshihiko Yagi

Kyosuke Osuka

Kazuki Fukada

Michio Sato

Isamu Aokura

Koji Naito

Munehiro Noda

Minako Hoshi

Shoji Ideno

Hajime Horii

Takashi Omura

Masanori Koyama

An imaging apparatus for capturing an image of a subject, the imaging apparatus includes: a first display; a second display including a display screen configured to change an orientation toward a subject side; a controller configured to control operations of the first and second displays; and a proximity detector configured to detect an object in proximity to the first display, wherein when a predetermined condition is satisfied, the controller causes the first display to display an image of the subject, and causes the second display to display an image showing the subject simultaneously with the first display.

Imaging apparatus

The electronic device has a power supply input unit which inputs power from an external power supply, an information processing unit which is capable of performing a first function and a second function which consumes more power than the first function does, a display unit which responds to power input to the power supply input unit by displaying whether or not to allow the performance of the first function and the performance of the second function, and an operation unit which receives an operation to be performed in response to the display on the display unit. The information processing unit switches between allowing only the performance of the first function and allowing both of operation in the first function and the performance of the second function according to the operation received by the operation unit.

Electronic device and imaging apparatus

An electronic device includes a power input unit through which power from an external power source can be input, a battery connector that is electrically connectable to a battery, a device connector that is electrically connectable to a removable external device, and a power controller that controls supply of power to the external device from the external power source and the battery. When the external device is connected to the connector, the power controller stops supplying power from the power input unit and supplies power from the battery to the external device, before supplying power from the external power source to the external device.

Temporarily switching an electronic device to battery power to handle inrush upon connection of an external device

An antibody provided by the present invention has a low reactivity with amyloid precursor proteins, and has a higher reactivity with amylospheroids than with amyloid &#x3b2; fibrils or monomeric amyloid &#x3b2;-proteins. According to the present invention, an antibody is provided that has a higher reactivity with amylospheroids than with amyloid precursor proteins, and has any one or more of the following properties: (i) a higher activity with amylospheroids than with amyloid &#x3b2; fibrils; (ii) a higher reactivity with amylospheroids than with monomeric amyloid &#x3b2;-proteins; and (iii) an activity of inhibiting neuronal cell death induced by amylospheroids.

Antibody and use thereof

A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects () to be bonded together are cleaned in an initial cleaning step (S) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one () of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S); a surface treatment step (S) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces () again; and the uneven bonding surface () is pressed against the other bonding surface () to bond them together.

Bonding method and apparatus

An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

Electronic part mounting apparatus and method

In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230&#xb1;10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

Bump bonding method apparatus

A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

Bare chip mounting method and bare chip mounting system

To provide a film substrate treatment apparatus that appropriately mounts film substrates on an electrostatic adsorption stage. In the film substrate treatment apparatus, adsorption pads are disposed on the first adsorption units that mount film substrates on an electrostatic stage, and a pressing member that presses the edge portion areas of the film substrates against the stage is provided. The film substrates can thereby be reliably attached to the stage, and the film substrates can be appropriately treated in a decompressed atmosphere.

Growing community of inventors

Osaka, Japan

Satoshi Horie