Nitto-Denko Corporation

Kyushu University

Satoshi Honda

Yuki Sugo

Naofumi Kosaka

Yosuke Shimizu

Nao Kamakura

Masayuki Satake

Kenichi Okada

Masayuki Okamoto

Atsushi Takashima

Taiki Shimokuri

Shou Takarada

Ryoko Asai

Ginji Mizuhara

Mayu Shimoda

Atsushi Yasui

Keisuke Okumura

Shotaro Masuda

Kensuke Tani

Hiroki Ago

Kenji Kawahara

Shun Oyama

Daisuke Mizuno

The present invention relates to a pressure-sensitive adhesive composition including a compound having a substituent represented by the general formula (1) described in the specification, in which when each of Rand Rin the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —ORand an oxygen atom of —ORis 1.31 Å or more and 4.70 Å or less, a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition, and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer.

Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet

The present invention relates to a laminate including a two-dimensional material and an adhesive sheet having a base material and an adhesive layer whose adhesive force decreases due to ultraviolet rays or heat, in which an adhesive force A at 25° C. of the adhesive layer before the ultraviolet rays or heat applies, to a silicon wafer is 1.0 N/20 mm to 20.0 N/20 mm when the adhesive layer is subjected to 180° peeling at a tensile speed of 300 mm/min, and a surface roughness of an adhesive surface of the adhesive layer after the ultraviolet rays or heat has been applied is 0.01 μm to 8.00 μm.

Method for producing laminate of two-dimensional material and laminate

Provided is a PSA sheet having a PSA layer. The PSA layer includes a layer A forming at least one surface thereof. The PSA sheet has an adhesive strength N0 of 2.0 N/10 mm or greater, after one day at room temperature following application of the layer A side to a surface of an alkaline float glass plate as an adherend having a contact angle of 5°-10° with distilled water; has an N1 to N0 reduction rate of 30% or lower, wherein N1 is a water-resistant adhesive strength measured after stored at room temperature for one day, immersed in water for 30 minutes, taken out from the water and then residual water is wiped off, and has an N2 to NO reduction rate of 40% or higher, wherein N2 is a water-peel strength measured after stored at room temperature for one day, 20 μL distilled water is dropped onto the adherend and is allowed to enter a PSA layer/adherend interfacial edge. N2 is measured at a tensile speed of 300 mm/min at a peel angle of 180°.

Pressure-sensitive adhesive sheet and method for peeling pressure-sensitive adhesive sheet

Provided is a method for peeling a PSA sheet adhered on a polarizing plate. The PSA sheet has a PSA layer. The PSA layer includes a layer A forming at least one surface of the PSA layer. Of the polarizing plate, the surface to which the PSA sheet is adhered is corona-treated or plasma-treated. The peeling method includes a water-peel step in which the PSA sheet is peeled from the polarizing plate, in a state where an aqueous liquid exits at the interface between the polarizing plate and the PSA sheet at the front line of peeling the PSA sheet from the polarizing plate, with the aqueous liquid allowed to further enter the interface following the movement of the peel front line.

Method for peeling pressure-sensitive adhesive sheet

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 &#x3bc;m or more and 50 &#x3bc;m or less.

Thermal bonding sheet and thermal bonding sheet with dicing tape

Provided is an optical PSA composition that can be easily peeled using an aqueous liquid such as water and has sufficient adhesive strength. An optical PSA composition comprising an acrylic polymer is provided. The PSA composition comprises at least one species of compound A selected among surfactants and compounds having polyoxyalkylene backbones. The monomers forming the acrylic polymer comprises less than 20 wt % alkoxyalkyl (meth)acrylate and less than 20 wt % alkoxypolyalkylene glycol (meth)acrylate. Alternatively, the compound A content is less than 1 part by weight to 100 parts by weight of the acrylic polymer.

Optical pressure-sensitive adhesive composition and use thereof

A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.

Sheet for heat bonding, and sheet for heat bonding having dicing tape

A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.

Sheet for heat bonding and sheet for heat bonding having dicing tape

Provided is a semiconductor device manufacturing method which can suppress the occurrence of positional deviation or inclination of a semiconductor element when the semiconductor element is fixed so as to be sandwiched-between two insulating substrates. The semiconductor device manufacturing method includes: obtaining a laminated body in which a semiconductor element is temporarily adhered on a first electrode formed on a first insulating substrate with a first pre-sintering layer sandwiched therebetween; temporarily adhering the semiconductor element on a second electrode formed on a second insulating substrate with a second pre-sintering layer sandwiched therebetween, the second pre-sintering layer being provided on a side opposite to the first pre-sintering layer, to obtain a semiconductor device precursor; and simultaneously heating the first pre-sintering layer and the second pre-sintering layer, to bond the semiconductor element to the first electrode and the second electrode.

Semiconductor device manufacturing method

Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

Joint manufacturing method

A thermal bonding sheet includes a pre-sintering layer containing copper particles and polycarbonate.

Growing community of inventors

Ibaraki, Japan

Satoshi Honda