Denki Kagaku Kogyo Kabushiki Kaisha

Satoshi Higuma

Hideki Hirotsuru

Shinya Narita

Hideo Tsukamoto

Yoshihiko Tsujimura

Goh Iwamoto

Nobuyuki Hashimoto

A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C&#x2014;BN, silicon carbide, and alumina and have an average particle diameter of 10-100 &#x3bc;m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 &#x3bc;m, a thermal conductivity at 25&#xb0; C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150&#xb0; C. of 4&#xd7;10to 7.5&#xd7;10/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member

Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly () is bonded to a circuit board () created by forming metal circuitry () on a metal substrate () with an insulation layer () therebetween, whereas an LED chip () of the LED chip assembly and the metal circuitry () of the circuit board are connected via an electrical connection member (), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant () including fluorescent material.

LED chip assembly, LED package, and manufacturing method of LED package

A base plate for power module, comprising an aluminum-silicon carbide composite and aluminum layers made of a metal containing aluminum as the main component formed on respective principal planes of the aluminum-silicon carbide composite, wherein the aluminum-silicon carbide composite is produced by forming or fabricating a flat plate-shaped silicon carbide porous body to have a thickness difference of at most 100 &#x3bc;m in the entire porous body and piling such porous bodies as they are each sandwiched between mold-releasing plates so that the fastening torque in the plane direction becomes from 1 to 20 Nm, and infiltrating a metal containing aluminum as the main component into the silicon carbide porous bodies, wherein the aluminum layers each has an average thickness of from 10 to 150 &#x3bc;m, the difference between the maximum thickness and the minimum thickness of the aluminum layer in each principal plane is at most 80 &#x3bc;m, and the difference between average thicknesses of the aluminum layers on the respective principal planes is at most 50 &#x3bc;m, and wherein the shape of the silicon carbide porous body is rectangle or a rectangle from which peripheral portions encompassing holes are removed.

Growing community of inventors

Omuta, Japan

Satoshi Higuma