Hitachi, Ltd.

Toyoda Gosei Co., Ltd.

Hitachi Kyowa Engineering Co., Ltd.

Satoshi Higashiyama

Hideaki Takemori

Kazuhiro Hirose

Kenji Mori

Teruhisa Akashi

Masatoshi Seki

Ryoichi Tohmon

Yoshishige Endou

Minoru Hirose

Hiroaki Kawaguchi

The optical mounting package of the present invention is featured by mounting a silicon frame on an insulating substrate for mounting the optical element. The package of the present invention is also featured by that the frame mounted on the insulating substrate for mounting the optical element is made of silicon. A method of manufacturing the package of the present invention is featured by mounting the silicon wafer on the insulating substrate.

Package for mounting an optical element and a method of manufacturing the same

A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base substrate having input/output terminals formed on a front side thereof, and a Si reflector having a sloped through hole and a reflecting film formed at least on a slope defining the through hole. The Si reflector is mounted on the Si base substrate and is fixedly joined to the Si base substrate. The Si reflector and the Si base substrate are joined to each other by a thin film solder.

Submount for light emitting diode and its manufacturing method

An optical element-mounting substrate that makes it easy to optically couple the optical semiconductor element to the optical fiber or to the lens and that can be highly integrated while suppressing deterioration in the high-frequency signals. The optical element-mounting substrate for optically coupling the optical semiconductor element to the optical fiber through the lens, comprises an insulating film formed on the surface of the optical element-mounting substrate, grooves formed on the substrate for installing the optical fiber and the lens, a thin-film electrode formed on the insulating film, a thin-film capacitor and a thin-film temperature sensor arranged maintaining a distance from the thin-film electrode, and a solder film formed on the insulating film in a region where the optical semiconductor element is mounted so as to be electrically connected to the thin-film electrode.

Optical element-mounting substrate and method of producing the same

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Hitachinaka, Japan

Satoshi Higashiyama