Disco Corporation

Satoshi Hanajima

Jun Nakama

Yoshimasa Kojima

Makoto Tanaka

Shinya Yasuda

Takeshi Kitaura

Harunobu Yuzawa

Natsuko Hanamura

Shigekazu Kanai

A method of using a processing apparatus that includes a holding unit with a rotatable chuck table for holding a workpiece; a processing unit for processing the workpiece; a camera for imaging the workpiece that is movable in an indexing feed direction; and a control unit for controlling the components. The method includes forming a linear processed mark in the workpiece, and then moving the chuck table to an imaging zone, where the camera images the processed mark. The method further includes calculating correction values or a correction angle, and carrying out processing feed of the chuck table in the imaging zone under a condition in which the camera has been corrected in position in the Y-axis direction based on the correction values or the chuck table has been rotated by the correction angle.

Method of using a processing apparatus

A cutting apparatus includes a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds a workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section. The removing unit includes a contact member positioned at a contact position for making contact with the transparent section and a retracted position, and an X-axis moving unit that relatively moves on the transparent section the contact member making contact with the transparent section.

Cutting apparatus and cutting method

A cutting apparatus includes a table including a support plate transparent in a visible region, a cutting unit, a first feeding mechanism that includes a first moving section for supporting the table and a first motor, a second feeding mechanism that includes a second moving section for supporting the cutting unit and a second motor, a first camera disposed on the side of a first surface of the support plate, a second camera disposed on the side of a second surface opposite to the first surface of the support plate, and a storage section that stores positional deviation amounts in the X-axis direction and the Y-axis direction between an imaging region at a reference position of the first camera and an imaging region at a reference position of the second camera.

Cutting apparatus

A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.

A processing apparatus includes a chuck table, a processing unit configured to process a workpiece held on the chuck table, a height measuring unit fitted to the processing unit, the height measuring unit measuring, as height data, heights at a plurality of coordinates of the holding surface measured while a moving unit is moved, a reading unit capable of reading an information medium, and a control unit. The chuck table includes an information medium on which identifying information distinguishing the chuck table is recorded. The control unit includes a height data recording section configured to record the height data and the identifying information in association with each other, and a processing control section configured to control a height of the processing unit during processing on the basis of the height data associated with the identifying information read by the reading unit.

Processing apparatus and chuck table

Disclosed herein is a water jet processing apparatus including a chuck table that holds a workpiece by a holding surface, a high-pressure water injection unit having a high-pressure water nozzle that injects high-pressure water along planned dividing lines of the workpiece to remove burrs, a processing feed unit that carries out processing feed of the chuck table in an X-direction, and an indexing feed unit that carries out indexing feed of the high-pressure water nozzle in a Y-direction. The water jet processing apparatus also includes a movement unit that moves the high-pressure water nozzle in a Z-direction, an alignment unit that images the workpiece, a cassette placement region in which a cassette that houses plural workpieces is placed, and a conveying unit that conveys the workpiece between the cassette and the chuck table.

Water jet processing apparatus

A cutting apparatus includes a cutting unit configured to cut a workpiece held on a chuck table, and a groove detecting unit including a CCD imaging element photographing the workpiece held on the chuck table. The groove detecting unit photographs, by the CCD imaging element, a laser-processed groove and a cut groove illuminated by an oblique illumination set such that a light amount of light in a direction parallel with an extending direction of the laser-processed groove as viewed in plan is higher than a light amount of light in a direction orthogonal to the extending direction of the laser-processed groove.

Cutting apparatus and groove detecting method

A processing method for processing a workpiece includes a holding step of holding the front surface side of the workpiece on which an alignment mark is formed by a holding table having a holding surface that reflects a near-infrared ray and exposing the back surface side and an imaging step of emitting the near-infrared ray toward the back surface side of the workpiece held by the holding table and imaging the workpiece by an imaging unit that has sensitivity to the near-infrared ray and faces the back surface side of the workpiece to form a captured image. The processing method also includes an alignment mark detection step of detecting the alignment mark based on the captured image and a processing step of processing the workpiece held by the holding table by a processing unit based on the detected alignment mark.

Processing method of workpiece

In a water jet processing method, when a nozzle adapted to emit water jet is moved relatively to a substrate to form a second cut line intersecting a first cut line, the relative travel speed of the nozzle is set to a second speed lower than a first normal speed by about 1/5  to 1/20  at least in a section anteroposterior to the intersection. Delay-inclination of a front edge of the second cut line is eliminated as much as possible to thereby prevent the occurrence of an insufficient processing area.

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Tokyo, Japan

Satoshi Hanajima