Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Satoshi Furuichi

Masahiro Taniguchi

Masahiro Kihara

Toshihiko Nagaya

Masanori Ikeda

Michinori Tomomatsu

Masafumi Inoue

Yousuke Hassaku

A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.

Component mounting using feedback correction

A mounting board manufacturing system includes: a component placer including a placing head and a placing head mover that moves the placing head to a target position for placing the component on the board; an inspector that inspects a placement position of the component by imaging the board; a correction value calculator that calculates a correction value for correcting the target position; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed.

Mounting board manufacturing system and mounting board manufacturing method

A component mounting system includes a plurality of component supply devices (tape feeders) each of which supplies components from a component supply position and a component mounter that sucks the components from the component supply position of each of the plurality of component supply devices with a plurality of nozzles (suction nozzles) to install the components onto a board. A suction position correction value for correcting a suction position shift from a regular suction position when each of the nozzles sucks the components from the component supply position is calculated. The suction position is corrected based on the suction position correction value to suck the components. A suction position shift amount from the regular suction position is calculated. A feeder evaluation value, which is a sum of the suction position correction value and the suction position shift amount, is calculated for each of the plurality of component supply devices.

Component mounting system

There is provided a mounting board manufacturing system including: a component placer including a placing head having a holding tool that holds a component and places the component on a board, and a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board; an inspector that inspects a placement position of the component placed on the board by imaging the board on which the component is placed by the component placer; a correction value calculator that calculates a correction value for correcting the target position using an inspection result, and updates the correction value using a new inspection result when the new inspection result is obtained; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed after the component placer stops the operation and the component is to be placed by the component placer.

In a component mounting system having an inspection device performing a mounting inspection after component mounting, a correction value for correcting a mounting program is calculated based on board inspection information including fed-back component position deviation information, a component is mounted on a board in accordance with the mounting program corrected based on the calculated correction value, and a 'present value' based on most recent board inspection information and a 'pre-correction evaluation value' are displayed together on an evaluation value display screen as evaluation values representing accuracy at a time of the mounting based on the board inspection information during this component mounting work, the &#x201c;pre-correction evaluation value&#x201d; being calculated based on a temporary position deviation amount pertaining to a case where it is assumed that no correction based on the calculated correction value has been performed.

Component mounting system and component mounting method

To measure a film thickness of a coating film () of a flux () serving as a bonding paste formed on a transfer stage () of a paste transfer unit (), the film thickness of the coating film () in a transfer area () is measured through a light-transmitting member () by a light interference method and by an optical type film thickness measuring sensor () which is arranged below the transfer stage (). Thus, it is possible to automatically and accurately measure the film thickness of the flux () in the transfer area () without requiring any complicated measurement work.

Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method

A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.

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Fukuoka, Japan

Satoshi Furuichi