The Furukawa Electric Co., Ltd.

Nippon Steel & Sumikin Chemical Co., Ltd.

Satoshi Fujisawa

Akira Kawakami

Yuuji Suzuki

Takeo Uno

Kazuhiro Hoshino

Takami Moteki

Yuji Suzuki

Koichi Hattori

Naoya Kuwasaki

Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 &#x3bc;m or below. On the roughened surface, an Ni&#x2014;Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 &#x3bc;m, a height of 0.6-1.8 &#x3bc;m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 &#x3bc;m. The aforesaid Ni&#x2014;Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dmor more.

Surface-treated copper foil, method for producing same, and copper clad laminated board

In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni&#x2014;Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni&#x2014;Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dmor more to provide a flexible copper clad laminate.

Flexible copper clad laminate

To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni&#x2014;Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)&#xd7;100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dmor more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni&#x2014;Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)&#xd7;100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dmor more.

Surface treated copper foil and copper clad laminate

An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content 'a' of the metal A and a content 'b' of the metal B forming the release layer satisfying an equation:10&#x2266;/()*100&#x2266;70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Ultrathin copper foil with carrier and printed circuit board using same

An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation:10&#x2266;/()*100&#x2266;70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation:10&#x2266;/()*100&#x2266;70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Growing community of inventors

Tokyo, Japan

Satoshi Fujisawa