Showa Denko K.k.

Citizen Seimitsu Co., Ltd.

Satoshi Fujinami

Kazuyuki Haneda

Takeshi Jonouchi

The polishing method of a disk-shaped substrate for polishing an outer circumferenceof a disk-shaped substrate using slurry is provided with in this sequence: a first polishing process for polishing the outer circumferenceusing an abrasive-grain inclusion brushmade of a resin in which polishing abrasive grains are included; and a second polishing process for polishing the outer circumferenceusing a resin brushmade of a resin in which the polishing abrasive grains are not included.

Polishing method and polishing apparatus

The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance; and guiding dust made by the grinding apparatus to the water by use of the air stream.

Disk-shaped substrate manufacturing method

The grinding method of a disk-shaped substrate that grinds a disk-shaped substrate including a portion having a hole at the center thereof while rotating the disk-shaped substrate is provided with: grinding an inner circumference of the disk-shaped substrate while an inner circumference grinding device is fed in a radial direction toward an outer circumference of the disk-shaped substrate and grinding the outer circumference of the disk-shaped substrate while an outer circumference grinding device is fed in the radial direction toward the inner circumference of the disk-shaped substrate; and stopping the feedings of the inner circumference grinding device and the outer circumference grinding device at the same time.

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Minamitsuru-gun, Japan

Satoshi Fujinami