Nippon Mektron Limited

Toyobo Co., Ltd.

Tatsuta System Electronics Co, Ltd.

Tatsuta Electric Wire & Cable Co., Ltd.

Satoshi Ebihara

Takahisa Kato

Kenji Kamino

Yoshinori Kawakami

Takahisa Akatsuka

Manabu Ohrui

Hideaki Tanaka

Takeo Wakabayashi

Kazuyuki Azuma

Hideyuki Koyanagi

Nobuto Sasaki

Kazuhiro Hashimoto

Takehisa Yane

Syohei Morimoto

Tomohiro Shimokawaji

The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250&#xb0; C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25&#xb0; C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.

Adhesive composition using polyamide-imide resin

Provided are both a flexible printed board, in which heat dissipation performance can be improved in without using an aluminum heal dissipating material, which is light in weight, has good processability and can be reduced in cost, and a method for manufacturing such a flexible printed board. The flexible printed board is a flexible printed boardon which a power consuming load is mounted, including: a front surface heat dissipation layermade of a copper foil and having a circuit portion on which the load is mounted; a thermally conductive resin layerhaving the front surface heat dissipation layerlaminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more; and a rear surface heat dissipation layer made of a copper foil, laminated to a rear surface side of the thermally conductive resin layer, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer

Flexible printed board and method for manufacturing flexible printed board

The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover filmis provided on one surface of a separation film, and an adhesive layeris formed on the surface of the cover filmopposite to the separation filmvia the metal layer. The cover filmhas at least one hard layerand at least one soft layer, and the surface of the cover filmfacing the separation filmis composed of the hard layer

Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board

Growing community of inventors

Tokyo, Japan

Satoshi Ebihara