Tokyo Electron Limited

Satoshi Asari

Katsuhiko Mihara

Kiichi Takahashi

Hiroshi Kikuchi

Izumi Sato

Katsuhiko Oyama

Yuichiro Sase

Katsuya Toba

Isao Shiratani

Tsuyoshi Murakami

Toshihiro Abe

Izumi Satoh

A vertical thermal processing apparatus including: a substrate supporter; a transfer mechanism to transfer substrates between the substrate supporter and a container; and a thermal processing furnace to process substrates that have been loaded thereinto with the substrate supporter. The substrate supporter includes: support columns located at intervals therebetween to surround the substrates, supporting parts for substrate and supporting parts for annular plate provided at the support columns in a tier-like manner, for alternately supporting peripheral parts of the substrates and of annular plates at predetermined intervals therebetween, and annular plates to be supported by the supporting parts for annular plate, when seen from a direction in which the substrates are transferred. Each of the annular plates has an intermediate part having a thickness smaller than thicknesses of the peripheral parts thereof to be supported by the support columns.

Vertical thermal processing apparatus and substrate supporter

A film forming apparatus includes a substrate holding unit holding substrates at intervals; a reaction chamber accommodating the substrate holding unit; a raw material gas supply pipe supplying a raw material gas of a thin film to the substrate; a support unit supporting the reaction chamber; a heating unit being disposed outside the reaction chamber and heating the substrates; a protection pipe including one end portion fixed to the support unit, being extended along an arrangement direction of the substrates between the substrate holding unit and the reaction chamber, and including a temperature measuring unit inserted therein; and a protrusion portion being provided on at least one of an outer surface of the protection pipe and an inner surface of the reaction chamber, and providing a gap between the outer surface of the protection pipe and the inner surface of the reaction chamber.

Film forming apparatus

The present invention is a processing apparatus comprising a transfer mechanism including at least one transfer plate, the transfer mechanism being configured to cause, when a substrate to be processed is placed on an upper surface of the transfer plate, the transfer plate to move while maintaining the substrate to be processed placed horizontally thereon. The transfer plate has a cantilevered support structure horizontally extending from a proximal end thereof to a distal end thereof in a fore and aft direction. An upper surface of the transfer plate is provided with a plurality of support projections configured to horizontally support the substrate to be processed at a substantially central position thereof and a rear position thereof in the fore and aft direction. The substrate to be processed is not supported on the distal portion of the transfer plate.

Vertical thermal processing apparatus

The present invention is a vertical-type heat processing apparatus comprising: a heat processing furnace; a holder capable of being loaded into the heat processing furnace and unloaded therefrom, with holding therein a plurality of objects to be processed at predetermined vertical intervals in a tier-like manner; a transfer mechanism including a base table capable of vertically moving and rotating, and a substrate supporter capable of horizontally moving on the base table; and a controller for controlling the transfer mechanism; wherein the transfer mechanism is adapted to transfer an object to be processed between a container containing a plurality of objects to be processed at predetermined intervals, and the holder; the substrate supporter includes a to-and-fro driving part for driving the substrate supporter in the horizontal direction, and a pitch-change driving part for changing a pitch at which the objects to be processed are supported; the controller is adapted to monitor at least one information of position, velocity and current fed back to a motor for driving the transfer mechanism; and the controller is adapted to judge, by comparing the monitored information with predetermined information corresponding to a normal drive, that the transfer mechanism is abnormally driven, and then is adapted to stop the drive of the transfer mechanism.

Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus

Disclosed is an improved transfer mechanism that transfers, in a vertical heat treatment system, process objects W between a container (carrier), and a holder (boat) holding plural process objects at vertical intervals. The transfer mechanism includes plural substrate support devices spaced at intervals, and each of the substrate support devices has a gripping mechanism for gripping a process object on the under side. The gripping mechanism includes a fixed engagement member on a distal end of the substrate support device, and a movable engagement member movably attached to a proximal end of the substrate support device.

Vertical heat treatment system and method of transferring process objects

A transfer mechanismof a vertical heat treatment systemincludes a base capable of vertical movement and turning movement, and plural substrate support devices, disposed on the base so as to be movable anteroposterior, that hold wafers W. Provided on the baseis a first sensorthat emits a light beam directed toward a direction in which the substrate support devicemoves anteroposterior, and detects the target member upon receipt of a reflected light of the light beam. Provided on two tip end portions of the substrate support deviceis a second sensorthat detects the target member upon interruption of a light beam traveling between the tip end portions by the target member. When a target memberprovided at its specific positions with projectionsandis placed at a position in a wafer boatthe basemoves vertically and turns, and the substrate support devicemoves anteroposterior. The position of the target member, or the transfer target position of the wafer, is automatically detected based on the detection signals of the first sensorand the second sensor obtained at the time and encoder values of drive systems relating to the movement of the baseand the substrate support member

Vertical heat treatment system and automatic teaching method for transfer mechanism

A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be contained in the thermal processing furnace through the furnace opening. A lid supporting the boat is capable of closing the furnace opening. A transferring chamber is connected to the furnace opening. An elevating mechanism provided in the transferring chamber is configured to move up and down the lid in order to load and unload the boat into and out from the thermal processing furnace. A connecting port provided at a wall of the transferring chamber is capable of being connected to an opening of a conveying container for containing the objects to be processed. A first containing portion provided in the transferring chamber is capable of temporarily containing unprocessed objects to be processed for a next thermal process. A second containing portion provided in the transferring chamber is capable of temporarily containing processed objects to be processed conveyed out from the thermal processing furnace. A transferring mechanism transfers objects to be processed between the conveying container, the first containing portion, the second containing portion and the boat.

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Oshu, Japan

Satoshi Asari