The Furukawa Electric Co., Ltd.

Furukawa Circuit Foil., Ltd.

Satoru Zama

Akira Tachibana

Masato Sakata

Chikahito Sugahara

Kenichi Ohga

Satoshi Suzuki

Yoshiaki Kobayashi

Kengo Mitose

Yuuji Suzuki

Yoshikazu Tsuzuki

Yuuki Kikuchi

Masato Ohno

Kazuto Ono

Toshio Mugishima

Hitoshi Yuzawa

A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 &#x3bc;m, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 &#x3bc;m.

Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part

Provided is a multilayer printed boardhaving three single-sided conductor pattern filmseach having a conductor patternformed on one surface of a resin filmhaving a through holeand a filled through holethat is the through holefilled with a conductorintegrally with the conductor pattern. These single-sided conductor pattern filmsare stacked in such a manner that their tops are oriented in the same way. The conductor patternsof the single-sided conductor pattern filmsare electrically connected via the filled through holes. As the conductor patternsof the single-sided conductor pattern filmsare interlayer connected via the filled through holes, the interlayer connection reliability can be enhanced.

Multilayer printed board and method for manufacturing the same

A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Composite material for electrical/electronic part and electrical/electronic part using the same

A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni&#x2014;Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 &#x3bc;m.

A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; forming the upper layer on the first laminate by plating to obtain a second laminate; and heating the second laminate to obtain the metal clad laminate. Further, the film is a flexible thermoplastic polymer film, the foundation layer is formed of a nickel alloy, the upper layer is formed of copper, at least one of the foundation layer and the upper layer has a compression stress before the step of heating the second laminate, and the metal clad laminate shrinks in a planar direction of the film during the step of heating the second laminate.

Metal clad laminate and method for manufacturing metal clad laminate

A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dmto make surface roughness Rz of 0.3 to 10 &#x3bc;m and height of the projection to be 0.3 to 10 &#x3bc;m. Surface roughness of the original foil is 0.1 to 5 &#x3bc;m and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Laminated circuit board

An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn&#x2014;Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn&#x2014;Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.

Growing community of inventors

Tokyo, Japan

Satoru Zama