Matsushita Electric Industrial Co., Ltd.

Satoru Yuuhaku

Seiichi Nakatani

Koichi Hirano

Yasuhiro Sugaya

Toshiyuki Asahi

Yasuyuki Matsuoka

Toru Ishida

Yasuhiko Hakotani

Tsutomu Nishimura

Yoshitake Hayashi

Hideo Kanzawa

A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in moduleincludes the insulating substratemade of a first mixtureand a second mixture, wiring patternsandformed on one principal surface and another principal surface of the insulating substrate, a circuit componentelectrically connected to the wiring patternand sealed with the second mixturein an internal portion of the insulating substrate, the inner via conductorelectrically connecting the wiring patternand

Circuit component built-in module, radio device having the same, and method for producing the same

A method of manufacturing a circuit board by forming a circuit pattern in a short process and capable of performing pattern transfer with stability. The manufacturing method includes a step of superposing on a carrier a resist layer in which a circuit pattern is formed and which is formed of a conductor or an insulator, a step of filling the circuit pattern with an electroconductive material, a step of removing the resist layer from the carrier, and a step of transferring the electroconductive material filled in the circuit pattern into an electrical insulating material.

Method of manufacturing circuit board and communication appliance

A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module includes the insulating substrate made of a first mixture and a second mixture wiring patterns and formed on one principal surface and another principal surface of the insulating substrate , a circuit component electrically connected to the wiring pattern and sealed with the second mixture in an internal portion of the insulating substrate , the inner via conductor electrically connecting the wiring pattern and

A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed. This fabrication method comprises a stop of forming a multilayer laminate by the green tape multilayer laminating method using dielectric ceramic tapes and a conductor paste containing CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of reducing CuO in the internal electrode layers to copper by heat-treatment in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of sintering the multilayer laminate in a nitrogen atmosphere (sintering process).

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Osaka, Japan

Satoru Yuuhaku