Fujikin Inc.

Tokyo Electron Yamanashi Limited

Tokyo Electron Limited

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Yamanashi Kabushiki Kaisha

Tohoku University

Tokyo Electron Limi Ted

Junkosha Co., Ltd.

Satoru Yamashita

Nobukazu Ikeda

Kouji Nishino

Masaaki Nagase

Atsushi Hidaka

Kaoru Hirata

Keiji Hirao

Katsuyuki Sugita

Yohei Sawada

Masahiko Matsudo

Takatoshi Nakatani

Yasushi Nagasawa

Ryousuke Dohi

Tadahiro Ohmi

Norihiko Amikura

Yasuyuki Shirai

Masahiko Takimoto

Risako Miyoshi

Nobuyuki Negishi

Kunio Sano

Kazuyuki Miura

Masayoshi Kawashima

Hiroshi Marumo

Shoichi Kanai

A control unitof a flow rate control systemcomprises: a recording unitfor recording measured values of a pressure sensor P and a temperature sensor T, a storage unitfor storing volume data between a first valve Vand a second valve Vcorresponding to the measured value of the pressure sensor P, and an arithmetic unitfor calculating a flow rate based on a first pressure value Pand a first temperature value Tmeasured after opening the first valve Vand the second valve Vto flow a gas and then closing the first valve Vand the second valve Vsimultaneously in a state where the gas is flowing; a second pressure value Pand a second temperature value Tmeasured after opening the first valve Vand the second valve Vto flow a gas, closing the second valve Vin a state where the gas is flowing, and then closing the first valve Vafter a predetermined time &#x394;t has elapsed; and a volume value V between the first valve Vand the second valve Vwhich corresponds to the second pressure value P

Flow rate control system and flow rate measurement method

A fluid control system () comprises: a first valve () provided downstream of a flow rate controller (), a flow rate measuring device () provided downstream of the first valve () and having a second valve (), an open/close detector () provided to the second valve (), and a controller () for controlling an open/close operation of the first valve () and the second valve (), and the controller () controls the open/close operation of the first valve () in response to a signal output from the open/close detector ().

Fluid control system and flow rate measurement method

The liquid level meter according to the present invention includes a resistive temperature detector, a temperature measuring body located above it, a temperature detecting unit detecting temperatures of the resistive temperature detector and the temperature measuring body, a current controlling unit determining a current value to be flowed through the resistive temperature detector so that the resistive temperature detector and the temperature measuring body become a predetermined temperature difference, a power supply unit supplying the current of the determined current value to the resistive temperature detector, and a liquid level detecting unit detecting a position of a liquid level. The liquid level detecting unit detects the change in the relative position of the liquid level relative to the resistive temperature detector by determining whether a change width of the current value flowing through the resistive temperature detector during a predetermined period of time is positive or negative, and whether the change width is not less than a predetermined value. As a result, the position of the liquid level can be accurately detected without being affected by the variation in the characteristics of the resistive temperature detector.

Liquid level meter, vaporizer equipped with the same, and liquid level detection method

A substrate processing system includes a gas supply unit having a first gas flow channel. A second gas flow channel of a flow rate measurement system is connected to the first gas flow channel. The flow rate measurement system further includes a third gas flow channel connected to the second gas flow channel, and a pressure sensor and a temperature sensor that measure a pressure and a temperature, respectively, in the third gas flow channel. In a method, a flow rate of a gas output from a flow rate controller of the gas supply unit is calculated using a build-up method. The flow rate of a gas is calculated without using the total volume of the first gas flow channel and the second gas flow channel and temperatures in the first gas flow channel and the second gas flow channel.

Method of determining flow rate of a gas in a substrate processing system

A vaporization supply apparatus comprises a vaporizer which heats and vaporize a liquid, a flow-rate control device which controls a flow rate of a gas sent out from the vaporizer, a first control valve interposed in a supply channel of a liquid to the vaporizer, a pressure detector for detecting a pressure of a gas vaporized by the vaporizer, a liquid detection part for measuring parameters of a liquid in an amount higher than a predetermined amount in the vaporizer, and a control device which controls the first control valve to supply a predetermined amount of a liquid to the vaporizer based on the pressure value detected by the pressure detector, and to close the first control valve when the liquid detection part detect a liquid in an amount higher than the predetermined amount.

Vaporization supply apparatus

To provide a liquid level indicator and a liquid raw material vaporization feeder, in which the time to detect a switch from the liquid phase to the gas phase has reduced flow rate dependence, and also the detection time can be shortened. The present invention includes a chamberthat stores a liquid raw material, at least one protection tubehousing a resistance temperature detector for detecting the liquid level Lin the chamber, and a flow controllerthat controls the flow rate of the gas flowing out from the chamberand feeds the same. The protection tubeis horizontally inserted into a sidewallof the chamberand fixed thereto.

Liquid level indicator and liquid raw material vaporization feeder

The present invention provides a raw material vaporization and supply device including a raw material receiving tank, a vaporizer for vaporizing liquid pressure-fed from the liquid receiving tank, a flow rate control device for adjusting a flow rate of raw material gas from the vaporizer, and a heating device for heating the vaporizer, the high-temperature pressure-type flow rate control device, and desired sections of flow passages connected to these devices, wherein AlOpassivation treatment, CrOpassivation treatment, or FeFpassivation treatment is applied to liquid contact parts or gas contact parts of metal surfaces of at least any of the raw material receiving tank, the vaporizer, the flow rate control device, the flow passages that links these component devices, or opening-and-closing valves that are disposed in the flow passages.

Raw material vaporization and supply apparatus

A vaporizer, capable of stabilizing the behavior of pressure inside the vaporizer, includes a chamber having an inlet and an outlet, a heating device that heats the inside of the chamber, a partition wall structurethat is provided inside the vaporizer and partitions the liquid material inside the chamber into a plurality of sections, and liquid distribution portionsthat are provided at the lower portion of the partition wall structureand that allow liquid distribution among the sections partitioned by the partition wall structure, and the partition wall structure includes a grid-like, honeycomb-shaped, mesh-like, or pipe-shaped partition wall.

Vaporizer

A cleaning apparatus for cleaning a probe card having a contact element to be brought into electrical contact with a pad of a circuit to be inspected, comprises a conductive brush to be brought into contact at least with the contact element to clean the probe card, and a gas blow mechanism for intermittently blowing gas to the brush. The conductive brush is vibrated by the gas blow, and a particle adhered from the probe card is removed by the vibrating brush and the gas jet.

Probe card cleaning apparatus, probe apparatus with the cleaning

The present invention relates to a probe needle wherein a conductive film is formed over a first insulating film formed around the outer periphery of a rod-like member through which a signal current flows, a second insulating film is formed over the outer periphery of the conductive film, and the conductive film is grounded. Since the rod-like member through which a signal current flows is thereby shielded, it is not affected by noise, and mutual crosstalk between signal currents is also prevented. Moreover, since ill effects caused by mutual contact with other probe needles is prevented by the second insulating film, reliable and stable measurement is possible. The coating of the probe needle is implemented by covering non-coating portions of the probe needle by a melted thermally liquefiable wax, hardening the thermally liquefiable wax covering the non-coating portions at room temperature, applying a coating to the probe needle by vacuum deposition, heating the thermally liquefiable wax once again, and then removing the thermally liquefiable wax from the probe needle. As a result, a probe needle is obtained wherein a non-coating portion is reliably delimited from a coating portion by a masking boundary. When the coating process is completed, the probe needle could be subjected to washing to completely remove any remaining wax.

Method of coating a conductive probe needle

Probe needle

A probe card is electrically connected to a tester, electrically contacted and connected to circuits to be tested, and used to transmit test signals between the tester and the circuits. It includes a plate assembly having a printed board and an earth plate insulated from each other. Probe assemblies are supported by the plate assembly and are substantially vertically contacted at their foremost ends with pads of the circuits to be tested. Each probe assembly includes a center conductor having a sharpened tip contacted with the pad of the circuit to be tested. A holder conductor shrouds the center conductor while leaving the front end portion thereof not enclosed, and having electrical continuity with the center conductor. A dielectric shrouds the holder conductor, a peripheral conductor coaxially arranged around the holder conductor with the dielectric interposed between them, and a sheath enclosing the peripheral conductor. The upper end of the holder conductor is electrically connected to a circuit on the printed board while the upper end of the peripheral conductor is electrically connected to a circuit on the earth plate.

Vertical probe tester card with coaxial probes

A probe is formed of an Au--Cu alloy essentially consisting of 74 to 76 parts by weight of gold and 24 to 26 parts by weight of copper, by a process comprising the steps of heating the alloy to at least 350.degree. C. and gradually cooling the heated alloy to the room temperature in at least 5 hours.

Probe and a method of manufacturing the same

A probe apparatus comprises a vertically movable table for placing a semiconductor wafer having semiconductor devices, a heater for heating the wafer at a predetermined temperature, and a probe card located above the wafer and having support and positioning portions for probes. The probe has a vertical portion which extends downward substantially vertically, and is capable of buckling. Two positioning plates are supported by the support positioning portion through which the vertical portions of said probes are downwardly extended wherein a temperature controller heats the probes at the positioning plates at a predetermined temperature.

Probe apparatus

A probe to be electrically connected to an internal circuit of a semiconductor element, comprising a contact portion to be brought into pressure contact with an electrode formed on the semiconductor element, wherein the contact portion is made of an alloy consisting of Au, Cu, and an inevitable impurity. The contact resistance between the probe and electrode is low, and is maintained low in a stable manner even if the probe is repeatedly used.

Growing community of inventors

Osaka, Japan

Satoru Yamashita