Ebara Corporation

Renesas Technology Corp.

International Business Machines Corporation

Renesas Electronics Corporation

Ttpcom Limited

Epoch Microelectronics, Inc.

Mitsubishi Electric Corporation

Hitachi High-tech Corporation

Uniden Corporation

Renesas Mobile Corporation

Ttpom Limited

Canon Kabushiki Kaisha

Satoru Yamamoto

Toshiya Uozumi

Kenji Kodera

Masayuki Nakanishi

Hiroyuki Kanda

Keiichi Kurashina

Hirotaka Osawa

Hariklia Deligianni

Mizuki Nagai

Kenji Kamimura

Jiro Shinbo

Yasuyuki Miyasawa

Koji Mishima

Yasuyuki Kimura

Robert Astel Henshaw

Junji Kunisawa

Tsutomu Nakada

Hirotaka Oosawa

Hidenao Suzuki

Keith Thomas Kwietniak

Keisuke Ueda

Brett Caroline Baker-O'Neal

Aleksander Dec

Ken Suyama

Mitsunori Samata

Brett Baker

Taizo Yamawaki

Emanuel Israel Cooper

Takashi Kawakami

Panayotis Constantinou Andricacos

Yasuhiro Yoshimura

Satoshi Arayashiki

Toshifumi Watanabe

Masato Ishizawa

Yasuharu Chiyoda

Atsushi Kazama

Katsuya Nakama

Masahiro Tsujibayashi

Kunihito Ide

Russell P Mohn

Phillipe Vereecken

Noriyuki Kurakami

Philippe M Vereecken

Shinya Morisawa

Yosuke Horie

Keisuke Uchiyama

Ryoichi Kimizuka

Takayasu Norimatsu

Kazuhisa Okada

Nobuhiro Kikuchi

Akira Susaki

Kenji Nagai

Takafumi Morihara

Hokuto Yamanobe

Yu Machida

Hiroshi Maebashi

Eiichi 108 Yaraicho Motoyama

Hidenori 6-18-10-201 Shinmachi Sunada

Yoshihito 2-30-10-1101 Shinkawa Osari

The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (); rotating the substrate (W) about its central axis by rotating the holding rollers () about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle () to a surface of the substrate (W) while moving the two-fluid jet nozzle () in a radial direction of the substrate (W), the two-fluid jet () being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle () to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

Substrate cleaning method and substrate cleaning apparatus

Provided is an automatic analyzer provided with a liquid level sensing function in which liquid levels in sample containers having various heights can be precisely detected using ultrasonic waves. This device is provided with: a conveyance rack for conveying a sample container which contains a sample and is loaded thereon; a fixed ultrasonic distance sensor for measuring the liquid level position in the sample container loaded on the conveyance rack; sound wave guides for suppressing diffusion of sound waves transmitted from the ultrasonic distance sensor, the sound wave guides being disposed between the sample container and the ultrasonic distance sensor; and a sound wave guide control unit for adjusting the length or switching the length of the sound wave guides in accordance with the distance between the ultrasonic distance sensor and the sample container.

Automatic analyzer

A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.

Substrate processing method and apparatus

A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction padincluding: a pad main bodyhaving a lower surface adhered to a stageof a substrate holder; and a plurality of circular arc-shaped substrate holding convexities, provided on a top surface of the pad main body, for holding a substrate W attracted by vacuum suction to the top surface of the pad main body, wherein the substrate holding convexitiesare arranged concentrically with the circular pad main body, and width Win a radial direction of the substrate holding convexitylocated on a radially outer side among the plurality of substrate holding convexitiesis narrower than width Win the radial direction of the substrate holding convexityon a radially inner side.

Vacuum suction pad and substrate holder

Vacuum contact pad

Pressing member for substrate polishing apparatus

An opening is formed in a top plate, and an opening is formed in a side plate which is approximately orthogonal to the top plate. A wall extending from a part of an edge part of the opening part and recessed toward the internal side of a casing includes an inclined surface inclined radially from the internal side of the casing to an edge part of the opening part and facing the opening part and the opening part.

Assembly structure for casing of electronic device, and electronic device

In an ADPLL composed of a digital circuit, a technique improving phase difference detection in a vicinity of a phase difference of 0 (zero) is provided. A feedback loop comprises a PFD comparing phases and frequencies of a reference signal and a feedback signal, a TDC converting an output of the PFD into a digital value, a DLF removing a high frequency noise component from an output of the TDC, a DCO controlled based on an output of the DLF and a DIV frequency-dividing an output the DCO and outputting the feedback signal. An offset value is added at any portion of the feedback loop, a phase of the feedback signal is controlled and a value other than 0 is inputted to the TDC even when the ADPLL is locked.

PLL circuit with improved phase difference detection

A phase detector, which forms a semiconductor device, detects a phase difference between a reference signal and a feedback signal obtained by feeding back an output signal of an oscillator, and generates a phase difference value indicating a value in accordance with the phase difference. An amplifier amplifies the phase difference value at a gain determined in accordance with a control signal from outside the device. A filter smoothes an output value of the amplifier. The oscillator controls a frequency of the output signal in accordance with an output value of the filter.

Semiconductor device and radio communication terminal mounting the same

An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.

Electroplating apparatus and electroplating method

A substrate processing apparatus can carry out removal of a passive layer (ruthenium oxide) present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer (ruthenium oxide) from the ruthenium film. The substrate processing apparatus includes: an electrolytic processing apparatus for electrochemically removing a passive layer, formed on a surface of a ruthenium film on a substrate, by electrolytic processing with the ruthenium film as a cathode; a copper electroplating apparatus for carrying out copper electroplating on the surface of the ruthenium film on the substrate; and an apparatus frame housing the electrolytic processing apparatus and the copper electroplating apparatus.

Substrate processing apparatus and substrate processing method

Growing community of inventors

Tokyo, Japan

Satoru Yamamoto