Fujitsu Corporation

Satoru Yamada

Kazuhiro Suzuki

Masakazu Kishi

Yuji Miyaki

Yasuhide Kuroda

Shigeichi Izumi

Kenichiro Tsubone

Yoshinori Nakane

Atsushi Yamaguchi

Shinichirou Kouno

Shinichirou Okamoto

A holding frame for an electronic device that is to be inserted and extracted into and from a pair of grooves formed in a chassis so as to face each other, the holding frame includes a pair of plates that are parallel to each other and that form portions of the holding frame, the portions extending along the grooves, three protrusions that are arranged along the grooves and that protrude from the plates toward the grooves, and two support portions that are arranged at portions of the holding frame each of which corresponds to a center portion between a corresponding two of the three protrusions, the two support portions supporting the electronic device between the plates and the electronic device.

Holding frame for electronic device

In a mounting device for disk drive, two HDDs are retained in an outer case that forms the mounting device, and an inner case with guiding grooves each including an oblique groove and a parallel groove formed thereon is provided. When the inner case is extracted, the HDD on the front side is caused to ascend in the vertical direction to a position where the HDD on the front side does not obstruct the extraction of the HDD on the back side.

Mounting device for storage device

An electronic device includes a housing having an accommodation space, a first support body being slidably insertable into the accommodation space in parallel with a predetermined plane, a second support body coupled with the first support body rotatably around a rotation axis parallel to a front side of the housing and being rotatable between a reference attitude disposed in the same plane with respect to the first support body and an inclined attitude disposed at a given angle with respect to the first support body, and a drive mechanism for changing the attitude of the second support body.

Electronic device

An optical module which can achieve miniaturization, high performance and cost reduction is, provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Optical module

A cooling structure of an electronic equipment includes substrate housing parts, an upstream side duct, a downstream side duct, an exhaust device and an air adjusting part. The substrate housing parts detachably house therein one or plurality of substrate units, and the downstream side duct allows the cooling air, which passed from the upstream side duct though the substrate housing part, to flow. The exhaust device is provided at an exhaust part to forcibly discharge air to the outside, thereby allowing the cooling air to flow to the substrate housing parts. The air adjusting part adjusts the volume for cooling air which flows to the downstream side duct.

Cooling structure of electronic equipment and information processing equipment using the cooling structure

An optical module which can achieve miniaturization, high performance and cost reduction is provided. The optical module includes a photoelectric component, a high-speed signal processing part which processes a high-speed signal photoelectrically converted by the photoelectric component, and a low-speed signal processing part which processes a low-speed signal. The high-speed signal processing part and the low-speed signal processing part are overlapped with each other in a vertical direction and electrically connected to each other.

Growing community of inventors

Kawasaki, Japan

Satoru Yamada