Panasonic Corporation

Satoru Waga

Masanori Minamio

Kazuto Nishida

Tetsushi Nishio

Tetsumasa Maruo

Toshihiko Satou

Kazuhiko Takahashi

According to the present invention, a protective seal Sfor protecting a transparent memberis composed of an organic base, adhesive layers, and a second adhesive layerhaving low adhesion. The adhesive layersare provided only on edges corresponding, on the organic base, to sidesof the transparent member and the second adhesive layeris provided on a portion corresponding, on the organic base, to a surfaceof the transparent member. The organic baseis fixed to the sidesand the surfaceof the transparent memberwith the adhesive layersand

Semiconductor device and method of manufacturing the same

The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.

Carrier frame for electronic components and production method for electronic components

Growing community of inventors

Niigata, Japan

Satoru Waga