Hitachi Chemical Company, Ltd.

Htiachi Chemical Company, Ltd.

Satoru Tsuchida

Masahiko Osaka

Shinsuke Hagiwara

Kazuyoshi Tendou

Masatsugu Ogata

Yasuaki Nakamura

Kouzou Hirokawa

The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 &#x3bc;m, and (D) an inorganic filler having an average particle diameter of less than 2 &#x3bc;m.

Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same

The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler

An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.

Encapsulant of epoxy resin and liquid aromatic amine curing agent

An epoxy resin composition for sealing a photo-semiconductor element, comprising

Epoxy resin composition for sealing photo-semiconductor element and

An epoxy resin composition for sealing a photosemiconductor element includes

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Ibaraki, Japan

Satoru Tsuchida