Kyocera Corporation

Satoru Tomie

Yusuke Takei

Shinichi Koriyama

Kenji Kitazawa

Tetsuya Suga

Mitsuo Yanagisawa

Michifumi Shoda

Shigeki Morioka

Kenichi Ura

A Faraday rotator mirror which is compact, allows high workability of manufacturing and has high reliability and high coupling efficiency is provided. The Faraday rotator mirror comprises a graded-index fiber, a Faraday rotator and a reflector mirror, wherein light incident via the graded-index fiber passes through the Faraday rotator to be reflected on the reflector mirror, and the reflected light passes through the Faraday rotator and emerges through the graded-index fiber.

Faraday rotator mirror and method for manufacturing the same

In a conventional high-frequency input/output feedthrough having a microstrip line, for a millimeter wave band, the reliability of a hermetic seal portion was low and transmission characteristics in the millimeter wave band were not preferable. A high-frequency input/output feedthrough of the present invention includes: a dielectric substrate with a ground conductor on a bottom face thereof; a wall member joined onto the top face of the dielectric substrate; a pair of line conductors formed in line with each other on both sides of the wall member on the top face of the dielectric substrate; an inside-layer line conductor which is formed to be in line and parallel with the pair of line conductors below the wall member inside the dielectric substrate, both ends of which are electrically connected by through conductors, to respective end portions of the pair of line conductors on both sides of the wall member, wherein an interval of the through conductors are set to be a quarter of a wavelength of a high-frequency signal to be used. The high-frequency input/output feedthrough is characterized by a hermetic seal portion of high reliability and preferable transmission characteristics.

High-frequency input/output feedthrough and package for housing a high-frequency semiconductor element

A high-frequency input/output feedthrough comprises a lower dielectric substrate in which are formed a bottom face ground layer, side ground layers, a line conductor and cofacial ground layers (formed on both sides of the line conductor on one and the same face of the lower dielectric substrate); and an upper dielectric substrate joined to the lower dielectric substrate so that portions of the line conductor and cofacial ground layers are sandwiched between the lower and upper dielectric substrate. In order to suppress return and insertion losses of signal in millimeter wave range due to a difference in transmission mode to improve transmission characteristics, the upper dielectric substrate is made thicker than the lower dielectric substrate. The width of the portion of the line conductor which is sandwiched between the lower dielectric substrate and the upper dielectric substrate is smaller than that of another portion. The cofacial ground layers are projected toward the line conductor. The transmission modes for high-frequency signals are matched, so that the return and insertion losses can be reduced and excellent transmission characteristics of high-frequency signals can be attained.

High-frequency input/output feedthrough and package for housing high-frequency semiconductor element using same

A structure for mounting a high-frequency device on an insulating board having a circuit on a top surface and transmitting signals to the high-frequency device. The high-frequency device is sealed within a cavity on a top surface of a dielectric board. The dielectric board has a first signal transmission line on its top surface and a second signal transmission line on its bottom surface, the first and second signal transmission lines overlapping each other over a portion where the signal is transmitted through coupling of the first and second signal transmission lines. A recess is formed at the top surface of the insulating board below the overlapping portion of the first and second signal transmission lines to suppress transmission loss of the high-frequency signal between the first and second signal transmission lines. The recess may be filled with air or a material having a dielectric constant low than that of the insulating board.

Structure for mounting a high-frequency package

A high-frequency input/output terminal comprises a lower dielectric substrate in which are formed a bottom face ground layer, side ground layers, a line conductor and cofacial ground layers (formed on both sides of the line conductor on one and the same face of the lower dielectric substrate); and an upper dielectric substrate joined to the lower dielectric substrate so that portions of the line conductor and cofacial ground layers are sandwiched between the lower and upper dielectric substrate. In order to suppress return and insertion losses of signal in millimeter wave range due to a difference in transmission mode to improve transmission characteristics, the upper dielectric substrate is made thicker than the lower dielectric substrate. The width of the portion of the line conductor which is sandwiched between the lower dielectric substrate and the upper dielectric substrate is smaller than that of another portion. The cofacial ground layers are projected toward the line conductor. The transmission modes for high-frequency signals are made even, so that the return and insertion losses can be reduced and excellent transmission characteristics of high-frequency signals can be attained.

High-frequency input/output feedthrough and package for housing

The invention relates to an optical semiconductor device housing package comprising a base having a mounting portion on an upper surface of which an optical semiconductor device is mounted; a frame attached to the base so as to encircle the mounting portion, the frame having a through-hole in one side thereof; a cylindrically shaped fixing member into which an optical fiber is inserted, the cylindrically shaped fixing member being fixed to the through-hole of the frame; a light-transmitting member attached to one end portion of the fixing member; and a lid member mounted on an upper face of the frame, for hermetically sealing the optical semiconductor device, wherein the light-transmitting member is formed of amorphous glass.

Growing community of inventors

Tokyo, Japan

Satoru Tomie