Murata Manufacturing Co., Ltd.

Satoru Takeuchi

Yoshikazu Sasaoka

A method and an apparatus for feeding electronic components are capable of increasing a rate of filling accommodation holes with electronic components. An accommodation plate including accommodation holes, respective openings of which are distributed over a main surface of the accommodation plate, is prepared, and electronic components are loaded onto the main surface of the accommodation plate. A horizontal vibration in an X-axis direction and/or a Y-axis direction and a vertical vibration in a Z-axis direction are applied to the accommodation plate with the main surface of the accommodation plate level. The horizontal and vertical vibrations have an equal number of vibrations and a prescribed phase difference therebetween. The accommodation plate is vibrated so that each of the electronic components is fed into one of the accommodation holes while moving over the main surface of the accommodation plate.

Method of feeding electronic components and electronic component feeder

A workpiece conveying apparatus for conveying a workpiece disposed in a through hole in a conveying table allows the workpiece to be reliably dismounted from the through hole using compressed gas, suppresses the workpiece from unintentionally jumping out because of residual pressure of the compressed air, and increases the conveying efficiency. In an electronic-component conveying apparatus, a conveying table is arranged to face a conveying surface of a conveying stage, with an electronic component disposed in a through hole in the conveying table. When the conveying table is rotated, the electronic component is conveyed. The conveying surface has an exhaust hole at a position where the electronic component is to be dismounted. The total area of the opening of the exhaust hole in the conveying table is larger than the area of the surface of the electronic component facing the conveying surface of the conveying stage.

Workpiece transfer apparatus and electronic component transfer apparatus

An electronic-component conveying apparatus that conveys an electronic component by holding the electronic component in a through hole provided in a conveying table of the apparatus, in which the electronic component can be quickly and reliably dismounted from the through hole by using compressed gas, and undesired popout of the electronic component due to a residual pressure infrequently occurs, whereby the efficiency in the conveying process can be increased. A workpiece conveying apparatus includes a blowhole opening in a conveying surface of a conveying stage and configured such that an electronic component held in a through hole is dismounted by using compressed gas at a position where the through hole overlaps the blowhole while a conveying table is driven, a vacuum groove communicating with the blowhole and provided in a first surface of the conveying table, and an auxiliary blowhole connected to a compressed-gas supply device and opening in the conveying surface such as to be accessible to the vacuum groove.

An electronic component conveying apparatus is provided in which an electronic component is accommodated in a through-hole of a conveyer table and is conveyed. The electronic component can be reliably picked up from the through-hole using a compressed gas in a short time. In addition, undesired exhaust of the electronic component due to a residual compressed air can be prevented, and the conveying efficiency can be increased. In an workpiece conveying apparatus, a first surface of a conveyer table includes a pressure relief groove that extends from a location at which the pressure relief groove overlaps with an exhaust hole in a direction crossing a conveying direction and communicates with a suction recess portion when the conveyer table is rotationally driven. Alternatively, the first surface includes a pressure relief hole for relieving pressure to the atmosphere.

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Echizen, Japan

Satoru Takeuchi