Nikon Corporation

Hitachi, Ltd.

Hitachi Software Engineering Company, Ltd.

Satoru Suzuki

Takuya Sato

Ryoichi Suganuma

Hirofumi Arima

Hitoshi Yokono

Mitsuo Nakatani

Masaaki Okunaka

Tokio Isogai

Hisanori Nasu

Tadashi Saitoh

Haruhiko Matsuyama

Hiroaki Yoshida

Sumiyuki Midorikawa

Eiichi Soeda

Kunihiro Matsukuma

Tomoichi Fukuda

An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.

Imaging unit and imaging apparatus

A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

Substrate, imaging unit and imaging device

An input apparatus for entering base sequence information of the gene, comprises a computer for analyzing the base sequence of the gene, an input apparatus for entering base sequence information of the gene to the computer which successively stores the base sequence information entered by the input apparatus and produces the stored base sequence information, and a speech sounding apparatus supplied with the base sequence information produced from the computer for sounding speech corresponding to the base sequence information produced from the computer.

Input apparatus for entering base sequence information of the gene

A process for producing solar cells which comprises applying a composition for anti-reflection coating formation on one side of a silicon base plate having a p-n junction therein, printing an Ag paste for contact formation on predetermined areas of the coat, and heat-treating the resulting plate at a temperature of 400.degree. to 900.degree. C. to complete anti-reflection coating and a light-receiving side contact, the process being characterized in that the composition for anti-reflection coating formation contains as essential component, (a) at least one member selected from the metal-organic ligand complex compounds represented by the general formula M(OR.sub.1).sub.n (L).sub.a-n wherein M is a metal selected from Zn, Al, Ga, In, Ti, Zr, Sn, V, Nb, Ta, Mo, and W; R.sub.1 is a C.sub.1 -C.sub.18 alkyl group; L is an organic ligand which forms an non-hydrolyzable bond with the metal ion; a is the valency of the metal M; and n is an integer satisfying 1.ltoreq.n&lt;a, and hydrolytic condensation products thereof represented by the general formula (OR.sub.1).sub.n-1 M(L).sub.a-n --O--M(OR.sub.1).sub.n-1 (L).sub.a-n, (b) an organotin compound, and (c) a solvent.

Process for producing solar cells

Growing community of inventors

Yokohama, Japan

Satoru Suzuki