Canon Kabushiki Kaisha

Satoru Sawada

Shinichi Takeda

Masato Inoue

Taiki Takei

Takamasa Ishii

Satoshi Okada

Kazumi Nagano

Keiichi Nomura

Kota Nishibe

Masayoshi Akiyama

Yoshihiro Ogawa

Kentaro Fujiyoshi

Shoshiro Saruta

Yoshito Sasaki

Minoru Watanabe

Keigo Yokoyama

Hiroshi Wayama

Akiya Nakayama

Yohei Ishida

Kazuya Furumoto

Tomoaki Ichimura

Noriaki Oguri

Takanori Taya

Masayoshi Tokumoto

Misaki Kuriyama

A radiation imaging apparatus includes an attenuation member on the back surface side opposite the radiation incident surface of a radiation detection unit. The attenuation member is configured to reduce unexpected appearance of a part disposed on the back surface side of the radiation imaging apparatus, the unexpected appearance of which occurs due to backscattered radiation reflected by the structured part on the back surface side of the radiation imaging apparatus. The attenuation member includes a material having a radiation transmittance higher than that of the part and covers the end portion of the outline of the part that overlaps the radiation detection unit in orthogonal projection onto the surface opposite the incident surface of the radiation detection unit, and the area of the attenuation member is smaller than that of the radiation detection unit.

Radiation imaging apparatus and radiation imaging system

A radiation image capturing apparatus includes, as a plurality of pixels two-dimensionally arranged in an image capturing area, a plurality of image pixels configured to output electric signals for acquiring a radiation image and a plurality of detection pixels configured to output electric signals for detecting information about irradiation of the image capturing area with the irradiation. The plurality of detection pixels is arranged as a line-shaped detection pixel group in the image capturing area, and a plurality of detection driving lines is connected to the line-shaped detection pixel group. A readout circuit reads out, at different timings, the electric signals group by group to each of which a different one of the plurality of detection driving lines is connected in the line-shaped detection pixel group.

Radiation image capturing apparatus and radiation image capturing system

A radiation imaging system includes pixel array, scanning circuit to scan rows of the pixel array, and readout circuit to read signals from the pixel array. Each pixel includes converter to generate electric signal corresponding to radiation and transistor connected to the converter. The readout circuit reads signal from the converter via the transistor. The system performs image capturing modes and conditioning mode of conditioning a threshold voltage of the transistor. In the conditioning mode, the scanning circuit supplies, to a gate of the transistor, an OFF voltage different from OFF voltages in the image capturing modes. The scanning circuit scans the rows in units of at least one row in the image capturing modes, and scans the rows in units of at least two rows in the conditioning mode.

Radiation imaging system

A radiation image pickup apparatus includes an image pickup panel in which a plurality of image pickup substrates including photoelectric-conversion elements is fixed onto a base, a scintillator portion including a scintillator layer of alkali halide-based columnar crystal and overlaid on the image pickup panel, and a moisture-proof layer provided between the base and the scintillator layer, at least between the plurality of image pickup substrates. The water vapor permeability of the moisture-proof layer is 10 g/m/day or less.

Radiation image pickup apparatus, and radiation image pickup system

A radiation detecting apparatus includes a scintillator and a photoelectric conversion panel. The photoelectric conversion panel includes a frame member disposed on an outer side of a photoelectric conversion section along at least a portion of one side of the photoelectric conversion panel. The frame member includes an inclined surface having a downward slope toward the photoelectric conversion section. The scintillator includes a first scintillator formed continuously on the inclined surface of the frame member and a surface of the photoelectric conversion section, and a second scintillator formed on the first scintillator. The first scintillator has a non-columnar crystal structure, and the second scintillator has a columnar crystal structure.

Radiation detecting apparatus and radiation detecting system

A radiation detection apparatus, comprising a housing including a first plate portion and a second plate portion arranged to face each other, a scintillator configured to convert radiation into light, supported by a supporting portion arranged in a side of the second plate portion in the housing, a sensor panel including a sensor array in which a plurality of sensors for detecting light are arrayed, interposed between the scintillator and the first plate portion in the housing, and a member interposed between the first plate portion and the sensor panel in the housing, wherein the sensor panel is arranged to position an outer edge of the sensor panel outside an outer edge of the scintillator, and the member is arranged to position an outer edge of the member inside the outer edge of the scintillator.

Radiation detection apparatus and imaging system

A radiation imaging apparatus comprising a plurality of sensor units each including a plurality of photoelectric converters, a substrate configured to support the plurality of sensor units, and a scintillator, wherein the scintillator comprises scintillator grains configured to convert radiation into light and a binder configured to make the scintillator grains adhere to each other, and the scintillator includes first portions provided between the plurality of sensor units and a second portion provided on the plurality of sensor units and the substrate.

An electric device, comprising a conductive guard ring formed on a substrate along an outer periphery of the substrate, an electrode formed inside the guard ring on the substrate, and a connecting portion formed above the electrode, for connecting an external apparatus and the electrode, wherein the connecting portion includes a conductive member for electrically connecting the external apparatus and the electrode, and an insulating member formed on a lower surface of the conductive member, and the insulating member exposes a portion of the conductive member, which is positioned immediately above the electrode, and an end of the insulating member is positioned inside the guard ring in planar view such that the conductive member and the guard ring do not contact each other.

Electric device, method for manufacturing the same, and radiation inspection apparatus

A radiation detection apparatus includes a sensor panel which includes a photoelectric conversion unit, a scintillator layer disposed above the photoelectric conversion unit and configured to convert radiation into light, a reflection layer disposed above the scintillator layer and configured to reflect part of light generated by the scintillator layer toward the sensor panel; and a protective layer which covers the scintillator layer from above the reflection layer. The scintillator layer is fixed on the sensor panel. The reflection layer is fixed on the protective layer. Part of the protective layer is bonded to the sensor panel with an adhesive material so as to seal the scintillator layer and the reflection layer with the protective layer and the sensor panel. An upper surface of the scintillator layer includes a portion which is not fixed to the reflection layer.

Radiation detection apparatus and radiation detection system

A radiation image pickup apparatus includes a base, at least one image pickup element, a scintillator, a first heat peelable adhesive layer which is arranged between the base and the image pickup element and which fixes the base and the image pickup element, and a second heat peelable adhesive layer which is arranged between the image pickup element and the scintillator and which fixes the image pickup element and the scintillator, and in the radiation image pickup element described above, the first heat peelable adhesive layer contains first heat-expandable microspheres, the second heat peelable adhesive layer contains second heat-expandable microspheres, and the first heat-expandable microspheres have a different expansion starting temperature from that of the second heat-expandable microspheres.

Radiation image pickup apparatus, radiation image pickup system, and method for manufacturing radiation image pickup apparatus

A radiation detection apparatus comprising a sensor panel in which a plurality of sensors for detecting light are arranged, and a scintillator layer containing scintillator particles for converting an incident radiation into light, and an adhesive resin which has an adherence property and bonds the scintillator particles, wherein the scintillator layer is adhered to the sensor panel by the adhesive resin, a modulus of elasticity in tensile of the adhesive resin is higher than 0.7 GPa and lower than 3.5 GPa, and a volume ratio of the adhesive resin to the scintillator particles is not lower than 1% and not higher than 5%.

A radiation detection apparatus including a sensor unit having photoelectric conversion units two-dimensionally arranged and a scintillator layer which converts radiation into light, comprising a first member disposed on the sensor unit, and a second member disposed on the first member, wherein the scintillator layer is disposed on the second member, and letting nbe a refractive index of the first member, nbe a refractive index of the second member, and nbe a refractive index of the scintillator layer, a relationship of n&#x3c;n&#x3c;nholds.

Radiation detection apparatus and radiographic system

A radiation imaging apparatus, comprising a sensor panel including a sensor array on which a plurality of sensors arranged in an array form and a scintillator layer provided on the sensor array, and a unit configured to perform signal processing based on a signal from the sensor array, wherein the sensor array includes a peripheral region and a central region located inside the peripheral region, the scintillator layer is disposed over the peripheral region and the central region so as to have uniform luminance efficiency with respect to the sensor array, and the unit performs the signal processing by using only signals from sensors disposed in the central region, of signals from the plurality of sensors, output from the sensor panel.

Radiation imaging apparatus, method for manufacturing the same, and radiation imaging system

A radiation imaging apparatus includes a substrate, at least one imaging element, a scintillator, a first heat peelable adhesive member which fixes the substrate to the imaging element, and a second heat peelable adhesive member which fixes the imaging element to the scintillator. An adhesive strength of the first heat peelable member is decreased by heat. A temperature of the first heat peelable adhesive member at which the adhesive strength is decreased is substantially equal to a temperature at which second heat peelable adhesive member fixes the imaging element to the scintillator. A heat transfer quantity per unit time of the substrate is different from that of the scintillator.

Growing community of inventors

Kodama-gun, Japan

Satoru Sawada