Nec Corporation

Satoru Onodera

Misao Iwatare

Makoto Moribe

Toshio Nakanishi

Keijirou Kadomatsu

Toshimasa Umetsu

Toshiki Shimasaki

Keijiro Kadomatsu

In a printed circuit board assembly comprising vertical printed circuit boards, perpendicular printed circuit boards, which are perpendicular to the vertical printed circuit boards, are disposed horizontally. A vertical back-board module is used. A vertical front board is arranged parallel in front of the vertical back-board module and has a front surface and a back surface. A connector group attaches the vertical back-board module to the back surface. With vertical attaching and receiving connectors, the vertical printed circuit boards are attached perpendicularly to the vertical front board. Similarly, the perpendicular printed circuit boards are attached perpendicularly to the back board module with perpendicular attaching and receiving connectors.

Printed circuit board assembly of vertical and horizontal printed boards

An electronic device package accommodatable in an electronic device casing. When a high density multipin connector is caused to mate with a connector mounted on the casing, the former is once brought to a stop just before mating with the latter and, therefore, prevented from rapidly mating with the latter. This eliminates the damage to the body of the connector and the deformation of the pins of the connector.

Electronic device package

Growing community of inventors

Miyagi, Japan

Satoru Onodera