Sumitomo Electric Industries, Limited

Nec Corporation

Satoru Okamoto

Tomohiko Ihara

Toshiyasu Tsubouchi

Masayuki Ishii

Hidetoshi Saito

Manabu Bonkohara

Shiro Nakajima

Masaaki Honda

Masataka Oji

Seiichi Nishino

Tetsuya Nishi

Kazufumi Terazi

An exhaust gas purifier which can efficiently eliminate particulate matter discharged from an engine, and which has a long life. The purifier is attached to a discharge passage of an engine, and includes a filter constituted by a plurality of cylindrical filter elements each formed of porous metal. The filter elements are different in diameter from each other, and disposed concentrically and assembled radially apart from each other through a space. The filter has an exhaust gas inlet passage side end and an exhaust gas outlet passage side end, the exhaust gas inlet side end being closed, by a shielding plate, up to the cylindrical filter element of the largest outer diameter, and the exhaust gas outlet passage side end being closed at a portion between an outer circumferential case and the cylindrical filter element of the smallest outer diameter. The exhaust gas purifier further includes a plate-like heater disposed between the filter element of the largest outer diameter and the filter element disposed inside and adjacent to the filter element of the largest outer diameter without contacting with the two filter elements. Preferably, three-dimensional mesh porous metal having the same average pore-size is used as a material for each of the cylindrical filter elements.

Exhaust gas purifier

In manufacturing a corrosion-resistant metallic porous member having high Cr content by diffusion process in which the material is heat-treated, a plurality of heat cycles are used to achieve uniform Cr content in the thickness direction. Metallic porous body of Ni, Fe, Ni-Cr or Fe-Cr is buried in a powder of Al, Cr and NH.sub.4 Cl. Inert gas such as Ar and H.sub.2 is introduced and the porous body is heat treated at 800.degree.-1100.degree. C. In the heat treatment, at least two temperature-increase and temperature-decrease steps are included.

Corrosion-resistant metallic porous member and method of manufacturing

A process for the production of a heat- and corrosion-resistant porous metal body which is made of a metal or whose surface layer is made of a metal, in which the porous metal body can be alloyed with chromium or a combination of chromium and aluminum uniformly throughout the entire thereof by adjusting the alloy composition in the following manner, i.e., (A) heat-treating the porous metal body in a mixed gas comprising a gas, generated by heating a powdered mixture comprising chromium or its compound and NH.sub.4 Cl at 950.degree. to 1100.degree. C., and a diluent reducing gas at 800.degree. to 1100.degree. C, or (B) heat-treating the porous metal body in a mixed gas comprising a gas, generated by heating a powdered mixture comprising aluminum or its compound, chromium or its compound and NH.sub.4 X, wherein X is I, F, Cl or Br, at a weight ratio of the chromium or its compound to the aluminum or its compound of 10 to 80 in terms of Cr and Al respectively at 950.degree. to 1100.degree. C., and a diluent reducing gas at 800.degree. to 1100.degree. C.

Process for the production of heat- and corrosion-resistant porous metal

A process for the production of a heat- and corrosion-resistant porous metal body which is made of a metal or whose surface layer is made of a metal, in which the porous metal body can be alloyed with chromium or a combination of chromium and aluminum uniformly throughout the entire thereof by adjusting the alloy composition in the following manner, i.e., (A) heat-treating the porous metal body in a mixed gas comprising a gas, generated by heating a powdered mixture comprising chromium or its compound and NH.sub.4 Cl at 950.degree. to 1100.degree. C., and a diluent reducing gas at 800.degree. to 1100.degree. C., or (B) heat-treating the porous metal body in a mixed gas comprising a gas, generated by heating a powdered mixture comprising aluminum or its compound, chromium or its compound and NH.sub.4 X, wherein X is I, F, Cl or Br, at a weight ratio of the chromium or its compound to the aluminum or its compound of 10 to 80 in terms of Cr and Al respectively at 950.degree. to 1100.degree. C., and a diluent reducing gas at 800.degree. to 1100.degree. C.

An unwoven metal fabric suitable for use as a battery electrode, a catalyst or a filter, and a method of manufacturing such fabric. An unwoven carbon fabric made up of carbon fibers bound together by a resin is heated to carbonize the binder resin and thus to impart electrical conductivity to the resin, and at the same time finely roughen the surfaces of the carbon fibers and the resin. A plating layer is directly formed on the unwoven carbon fabric thus formed by electroplating. Then, the unwoven carbon fabric is removed by roasting to provide an aggregate of metal fibers joined together and having their voids communicating with one another.

Unwoven metal fabric

In manufacturing a corrosion-resistant metallic porous member having high Cr content by diffusion process in which the material is heat-treated, a plurality of heat cycles are used to achieve uniform Cr content in the thickness direction. Metallic porous body of Ni, Fe, Ni--Cr or Fe--Cr is buried in a powder of Al, Cr and NH.sub.4 Cl. Inert gas such as Ar and H.sub.2 is introduced and the porous body is heat treated at 800.degree.-1100.degree. C. In the heat treatment, at least two temperature-increase and temperature-decrease steps are included.

Particulate trap for purifying diesel engine exhaust

The present invention relates to a semiconductor casing which permits transmitting ultraviolet rays to a semiconductor chip within the casing. The semiconductor casing includes the substrate formed by a thin metal plate for mounting the semiconductor chip, a ceramic frame fixed to the periphery of the substrate, a ceramic cap which covers the semiconductor chip, is mounted on the ceramic frame and allows transmission of ultraviolet rays, and leads which are sandwiched between the ceramic frame and the ceramic cap to allow the electrical connection of the semiconductor chip.

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Itami, Japan

Satoru Okamoto