Hitachi, Ltd.

Satoru Ogihara

Nobuyuki Ushifusa

Hiroichi Shinohara

Hideo Suzuki

Yukio Takeda

Kunihiro Maeda

Mitsuru Ura

Kiyoshige Kinugawa

Fumiyuki Kobayashi

Kousuke Nakamura

Tadashi Ishibashi

Takeo Yamazaki

Hironori Kodama

Kousei Nagayama

Kazuji Yamada

Tadahiko Miyoshi

Takashi Namekawa

Kanji Otsuka

Tasao Soga

Shingo Shirakawa

Kunio Miyazaki

Shunichi Numata

Hirokazu Inoue

Hideo Arakawa

Yasuo Matsushita

Tadamichi Asai

Tetsuo Kosugi

Shizuo Ishitani

Tokio Ohkoshi

Shinichi Owada

Yosio Hanada

Katsumi Kondo

Takashi Naito

Takashi Yokoyama

Akio Takahashi

Yutaka Sugita

Akio Mukoh

Ken Takahashi

Yutaka Watanabe

Masato Isogai

Masahide Okamoto

Tomoji Oishi

Minoru Yamada

Gyozo Toda

Yasuhiko Kando

Juichi Morikawa

Keiichirou Nakanishi

Yoshiyuki Yasutomi

Masakazu Yamamoto

Shuichi Ohara

Naoki Kikuchi

Osamu Miura

Osamu Asai

Hiromi Kagohara

Yoshimichi Shibuya

Masatoshi Ito

Katsuhisa Usami

Masatoshi Tsuchiya

Yoshihiro Suzuki

Seiichi Yamada

Takanobu Noro

Jun-ichi Hirakata

Yoshiyuki Ohzawa

Ren Ito

Takashi Naitoh

Moritaka Shoji

Kosei Nagayama

Tadahiko Moyoshi

An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

Mounting substrate

A display device, which is adapted for time-division driving and is free from occurrence of crosstalk, includes a pair of substrates which are arranged to be opposite to each other and at least one of which is transparent, electrodes provided respectively on surfaces of the substrates facing each other, and a material which is sandwiched between the electrodes and the light transmitting quantity of which is changed by an electric field applied between the electrodes. The electrodes formed on the surfaces of the substrates facing each other constitute scanning electrodes and signal electrodes which intersect each other to form display portions. The signal electrodes constitutes independent electrodes formed independently of each other in units of display portions. Outside leads of the respective independent electrodes are passed through the substrate provided with the electrodes and are led out to the back surface of the substrate.

Dot-matrix type display device

A method of producing a sintered multi-layer ceramic body used for ceramic parts of various electronic devices such as multi-layer substrates for LSI packaging and highly functional structural materials and by applying a pressure and/or constraining force to an outermost surface of the laminate. The method is featured by the shape of the surfaces to which a pressure and/or constraining force are not applied, ranges of the pressure and/or the constraining force, and the like.

Method for producing multilayer ceramic body with convex side faces

An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.

Installation structure of integrated circuit devices

The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules. This substrate comprises a conductor layer and a plurality of ceramic insulating layers wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer. The present invention further provides a method for making this substrate which comprises preparing fiber-containing composite green sheets by adding to a green sheet raw material at least one of whiskers, glass filaments and chopped strands as fibers, laminating these fiber-containing composite green sheets in such direction that their casting directions are different together with green sheets containing no fibers to form a laminate and firing this laminate.

Ceramic laminated circuit substrate

A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion coefficient as that of the semiconductor chip, are also provided. Each such intermediate ceramic substrate has contacts on its front and back faces corresponding to those of the semiconductor chip. These contacts are electrically connected directly in a one-to-one relationship. The contacts on the semiconductor chip and the corresponding ones on the front face of the intermediate ceramic substrates are connected by solder. The contacts on the back face of the intermediate ceramic substrate and the corresponding contacts on the front face of the multi-layered ceramic circuit board are connected by respective conductive pins having a predetermined flexibility and rigidity through a predetermined gap therebetween. With this arrangement, the relative displacement due to a thermal expansion difference between the intermediate ceramic substrate and the multi-layered organic circuit board is permitted without causing substantial stress thereon.

Semiconductor chip module

An integrated circuit package produced by bonding a rear surface of an insulating substrate enclosed in the package to a heat sink such as a cooling fin by a resinous adhesive, which may include one or more fillers, having a Young's modulus of 500 kg/cm.sup.2 or less when formed into a film, has high reliability at the bonding portion and withstands without damages even if subjected to thermal shocks.

Integrated circuit package having heat sink bonded with resinous adhesive

The present invention relates to a chip carrier, on which LSI chips are mounted and a chip carrier is disclosed, in which a region where power source throughholes are arranged and a region where signal throughholes are arranged are separated from each other and a coupling capacitor is formed only in the region where the power source throughholes are arranged with an intention to reduce noise.

Chip carrier

A composite sintered oxide resistor comprising crystal grains of zinc oxide and crystal grains of a zinc oxide compound of other metal or semi-metal element than zinc, and a grain boundary layer having an electric resistance equal to or lower than that of the crystal grains of zinc oxide between the individual crystal grains and which has a very large withstanding capacity against switch surge, a small non-linear coefficient of voltage in the voltage-current characteristics, a positive, smaller resistance-temperature coefficient, and a small percent change in resistivity after heat treatment at 500.degree. C. in the atmosphere.

Oxide resistor

A condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant than that of the ceramic insulating material and a pair of electrodes sandwiching the ceramic dielectric condenser material, the condensers being in a layer structure with openings concentric to the individual throughholes and having a larger diameter than the diameter of the throughholes with a distance between the condenser opening edges surrounding the corresponding throughholes and the throughhole peripheral edges, thereby forming clearances therebetween and the ceramic insulating material being filled in the clearances between the condenser opening edges and the corresponding throughhole peripheral edges without any contact with the ceramic dielectric condenser material and the throughholes can reduce electric noises owing to the presence of the condenser without impairing the signal transmission speed, when applied to a board for a large-scale electronic computer, thereby making the computing speed faster than the conventional one.

Condenser-containing, ceramic multi-layer circuit board and

A ceramic multilayer circuit board comprising ceramic layers and wiring conductor layers laminated alternately, in which the ceramic layer has a thermal expansion coefficient lower than that of the wiring conductor and not lower than one half of that of the conductor layer and is formed from a glass which softens at a temperature not higher than the melting point of the wiring conductor layer; a semiconductor module having a high reliability in its solder joint part comprising said ceramic multilayer circuit board mounted with a ceramic carrier substrate being mounted with a semiconductor device, said board being able to use a silver or copper conductor having a good electro-conductivity; and an amorphous glass powder for said ceramic multilayer circuit board.

Ceramic multilayer circuit board and semiconductor module

The present invention provides a highly thermal conductive, electrical insulating ceramic body having at least 90% of theoretical density and comprising 20 to 40% by weight of silicon carbide, the balance being substantially aluminum nitride, the silicon carbide containing not more than 0.1 by weight of sum total of boron, aluminum and nitrogen and not more than 0.2% by weight of sum total of iron, titanium, vanadium, chromium and nickel, and the aluminum nitride containing not more than 1% by weight of oxygen and not more than 0.5% by weight of sum total of silicon, iron and magnesium, the sintered body having a thermal conductivity at 20.degree. C. of at least 250 W/m..degree.K, an electrical resistivity at 20.degree. C. of at least 10.sup.10 .OMEGA.. cm, a dielectric strength at 20.degree. C. of at least 20 kV/cm, a dielectric constant at 1 MHz of not more than 10, a bending strength at 20.degree. C. of at least 400 MPa and a fracture toughness at 20.degree. C. of at least 5MN/m.sup.3/2. The present sintered body can be used as a substrate for a semi-conductor device, and a semi-conductor device using the present sintered body has good heat radiation. The present sintered body can be used as a substrate for a semi-conductor device, and a semi-conductor device using the present sintered body has a good heat radiation characteristic.

Electrical insulating, sintered aluminum nitride body having a high

A magnetic head has a layer of amorphous magnetic alloy arranged to define a magnetic gap therebetween, the layer being bonded with a bonding glass having a viscosity of 10.sup.5 poises or less at a temperature by at least 50.degree. C. lower than the crystallization temperature of the amorphous magnetic alloy, a good water resistance after sintering and a low coefficient of thermal expansion such as 100.times.10.sup.-7 /.degree.C. or less. The bonding glass contains 55 to 70% by weight of V.sub.2 O.sub.5, 17 to 25% by weight of P.sub.2 O.sub.5, 3 to 20% by weight of Sb.sub.2 O.sub.3, 0 to 20% by weight of PbO, 0 to 15% by weight of Tl.sub.2 O, and 0 to 5% by weight of Nb.sub.2 O.sub.5.

Magnetic head having layers of amorphous magnetic alloy bonded together

This invention provides a ceramic multi-layer circuit board wherein electroconductive patterns and ceramic insulating layers are piled alternately, characterized in that each ceramic insulating layer is a sintered product comprising one or more kinds of silica and a glass. Since the glass has a softening point lower than the melting point of the material of the electroconductive patterns, it enables sintering of the ceramic multi-layer circuit board at low temperatures. The silica is effective for reduction of the dielectric constant of each ceramic insulating layer.

Process for producing a ceramic multi-layer circuit board

The glass composition is particularly applicable for ferrite constituents used for a highly efficient magnetic head. The composition essentially consists of (a) 55-70 wt % of V.sub.2 O.sub.5, (b) 18-wt % of P.sub.2 O.sub.5, (c1) up to 10 wt % of at least one alkaline metal oxide selected from Na.sub.2 O, K.sub.2 O, Rb.sub.2 O, and Cs.sub.2 O and (c3) up to 10 wt % of Tl.sub.2 O. The composition is in a non-crystalline state during reheating and has a softening temperature of 310.degree. C.-400.degree. C. and a thermal expansion coefficient of 70-130.times.10.sup.-7 /.degree.C.

Ceramic body glass composition for bonding and filling ceramic parts

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Hitachi, Japan

Satoru Ogihara