Murata Manufacturing Co., Ltd.

Satoru Noda

Kunihiko Hamada

Takeshi Miki

Jun Harada

Shingo Ito

Atsuyoshi Maeda

Kazuo Hattori

Isamu Fujimoto

Hidekiyo Takaoka

Shinichiro Kuroiwa

Tsutomu Ieki

Makoto Kawagishi

Tadashi Kani

Satoshi Shindou

A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.

Component-embedded substrate

A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.

Package substrate

A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

Composite electronic component

A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components connected to the lands to mount components. The circuit components are embedded in the resin layer. The plurality of lands have thicknesses that are greater than those of the wiring patterns adjacent to the corresponding lands.

Component incorporating module

A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the plurality of terminal electrodes are connected to the first principal surface and define a first terminal electrode group, and at least two of the plurality of terminal electrodes are connected to the second principal surface and define a second terminal electrode group. One terminal electrode in the first terminal electrode group is electrically connected to one terminal electrode in the second terminal electrode group via the internal electrodes, and capacitance is provided by a pair of the terminal electrodes in the first terminal electrode group via the dielectric layer, and capacitance is provided by a pair of the terminal electrodes in the second terminal electrode group via the dielectric layer. A direction in which the internal electrodes are stacked is parallel or substantially parallel to the two principal surfaces.

Component-embedded substrate and component package using component-embedded substrate

Method of manufacturing composite electronic component

A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.

Thick film electrode and multilayer ceramic electronic device

Provided is a Ag-based conductive paste for a terminal electrode which suppresses oxidation of the Ni surface of an internal conductor and therefore brings about excellent joining with Ni even when baking is performed in the atmosphere in the case where Ni is used as the internal conductor of a laminated ceramic electronic component. The conductive paste includes at least one of an Ag powder and an Ag alloy powder, a nickel boride powder, an inorganic binder and an organic vehicle, wherein the quantity of the nickel boride powder is within the range of about 5% by weight or more, but less than about 60% by weight of the total paste.

Method for manufacturing laminated electronic component

A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.

Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component

A ceramic electronic part includes a ceramic assemblage containing laminated plural ceramic sheets, plural inner electrodes formed between the ceramic sheets and containing Ni as a major component, and outer electrodes electrically connected to the inner electrodes. The outer electrodes contain Ag as a major component and Au and an inorganic oxide as minor components.

Ceramic electronic parts and method for manufacturing the same

A laminated ceramic capacitor is provided having superior elastic and bending characteristics and having a high mechanical strength withstanding the thermal shock generated when mounting is performed on a circuit substrate by soldering. The laminated ceramic capacitor is composed of a laminate and external electrodes, wherein the laminate is formed of a plurality of ceramic layers and a plurality of internal electrodes provided therebetween so that an end of each internal electrode is exposed at one of edge surfaces of the laminate, and the external electrodes are connected to the internal electrodes and contains a conductive component and a glass having a Young's modulus of about 9&times;10 Pa or less.

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Hikone, Japan

Satoru Noda