Hitachi Engineering Services Co., Ltd.

Kawamura Sangyo Co., Ltd.

Satoru Nakanishi

Miyoshi Yokura

Kenichirou Tada

Hisashi Katsumata

Masashi Kato

Tetsuo Inoue

Taku Yamaga

Shun Ito

Kenichi Watanabe

A low-temperature plasma treatment is applied to a surface of an aramid paper so as to allow the surface to have a compositional atomic ratio X (O/C) of the number of oxygen atoms (O) to the number of carbon atoms (C) ranging from 110% to 220% of a theoretical atomic ratio. The treatment is performed at an intensity ranging from 120 to 1500 W&#xb7;min/mwith a low-temperature plasma treatment apparatus of internal electrode system. The aramid paper is superposed with a nonhydrolyzable resin film and the resulting article is pressurized to give an aramid-resin film laminate. The laminate is inexpensive, has both superior electrical properties and high mechanical strength, excels in elasticity, and is useful as an insulation material.

Method of manufacturing adhesive-free laminate of aramid paper and polyphenylene sulfide film, and insulation material and insulation structure for rotating electric machinery

A laminate comprising aramid paper containing aramid fiber and aramid pulp and polyester film, the aramid paper and polyester film having been subjected to plasma surface treatment before laminating, wherein the aramid paper and polyester film are continuously bonded to each other. The disclosure is concerned with a process for manufacturing the laminate and an apparatus for manufacturing the laminate.

Adhesive-free aramid-polyester laminate, method of manufacturing the same and apparatus for manufacturing the same

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Ibaraki, Japan

Satoru Nakanishi