Fuji Electric Co., Ltd.

Satoru Nagano

Yoichi Shindo

Shoji Kitamura

Kenji Kunihara

Hiromi Mojikawa

Tadashi Umegaki

Katsumi Oguri

In a resin-sealed laser diode device, in order to prevent the sealing resin on the front light-emitting end face of the laser diode chip from being deteriorated by the laser beam, a thermosetting rubber-like organic silicone resin layer is formed on the front light-emitting end face to a thickness of at least 50 &mgr;m on the extension of the surface of the active layer. On the side of the rear light-emitting end-face of the laser diode chip, the rubber-like organic silicone resin layer on the photo-diode is curved upwardly with respect to the light receiving surface of the latter. Furthermore, in order to prevent the far field pattern of the laser beam from being made irregular, at least the surface of the end-face protecting film on the light-emitting end face essentially contains silicon dioxide.

Resin-sealed laser diode device

A lead frame 32 has projecting portions 36, 37 projecting in a right-and-left direction, like arms, from the sides of its broad end portion 32a. The projecting piece portions 36, 37 include mold region parts 36a, 37a that are molded within a flat type sealing resin member 35, and exposed piece portions 36b, 37b that are exposed to the outside from the sealing resin member 35. One of the exposed parts, 36b, has an arcuate segment 36c inscribed in a hypothetical circle drawn with radius R about the point of light emission, C, on an LD chip 1. The other exposed part 37b has an arcuate segment 37c inscribed in the hypothetical circle drawn with radius R. A semiconductor laser device having these arcuate segments can be fitted into a stepped accommodating hole of an instrument and set in place there, just as can a can type semiconductor laser device. The point of light emission, C, on the LD chip 1 is also fixed. Thus, neither a shift in the point of light emission, C, nor the peeling of resin arises. Moreover, an annular mounting aid 48 inscribed in the hypothetical circle drawn with radius R can be attached, instead of the arcuate segments 36c, 37c, to the exposed parts 36b, 37b, whereby the same effects can be obtained.

Semiconductor laser device

Growing community of inventors

Kawasaki, Japan

Satoru Nagano