Thk Co., Ltd.

Shinkawa Ltd.

Satoru Nagai

Toru Maeda

Hiroyuki Arai

Osamu Watanabe

Tomonori Nakamura

Satoshi Fujita

Akimasa Yoshida

Kentaro Nishimura

Masakazu Uesugi

Akira Suzuki

Hideki Fujii

Hidekazu Michioka

Katsuya Iida

Satoshi Hara

Yoshihiro Saeki

Shuhei Yamanaka

Masahiko Yoshino

Masashi Ishii

Katsuya Fukushima

Yuichiro Noguchi

Yoshiyuki Honjo

Tomofumi Mizuno

Hiroki Niwa

Shogo Wakuta

Shigeki Hayashi

Kazuto Oga

Yukitaka Sonoda

Masatomo Tokuno

Hironori Shoji

Shin Takayama

Yoshitaka Takahashi

Mitsuaki Homma

Midori Kobayashi

Takuya Sakamoto

Hiroshi Inoko

An abnormality diagnosis system that diagnoses an abnormality related to each control shaft in equipment in which the plurality of control shafts, each including a motor and an output unit driven by the motor, are incorporated, includes: a plurality of vibration sensors that are provided for the plurality of control shafts, respectively, and that detect vibration occurring in connection with driving of the motor corresponding to each control shaft; a calculation unit that calculates, for each of the plurality of control shafts, vibration levels in a plurality of predetermined frequency ranges, based on vibration information detected by each of the plurality of vibration sensors; and a diagnosis unit that diagnoses an abnormality related to each control shaft, based on a distribution state, across the plurality of predetermined frequency ranges and across the plurality of control shafts, of the vibration levels calculated by the calculation unit.

Abnormality diagnosis system and abnormality diagnosis method

The present invention reduces tact time for a pick-and-place operation by an actuator. In a housing of the actuator, an air passage being a passage of air when sucking air from a hollow part of a shaft is provided. Furthermore, a sucking valve that sucks air from the hollow part of the shaft through the air passage and a suction detecting sensor to detect that a workpiece is suctioned onto a tip of the shaft are provided in the air passage. Then, in the housing, the air passage is disposed at a position on a side opposite to a linear motion motor that moves the shaft in an axial direction of the shaft, via the shaft.

Actuator

Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.

Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus

[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding devicefor thermally bonding an electronic componentto a substrateor to another electronic component via an adhesive material, the bonding device being provided with: a bonding toolcomprising a bonding distal-end portionwhich includes a bonding surfaceand tapered side surfacesformed in a tapering shape becoming narrower toward the bonding surface, the bonding surfacehaving a first suction holefor suction-attaching the electronic componentvia an individual piece of a porous sheet, the tapered side surfaceshaving second suction holesfor suction-attaching the porous sheet; and a bonding control unitwhich controls the first suction holeand the second suction holesindependently from each other.

Bonding apparatus and bonding method

A flip-chip bonding apparatus () is provided with: a bonding tool () that includes a base (), and an island () that vacuum-sucks, to a surface () thereof, a semiconductor die () having protruding electrodes () that are disposed on both the surfaces; and a heater () that heats the semiconductor die () vacuum-sucked to the island (). The flip-chip bonding apparatus heats the semiconductor die (), bonds the protruding electrodes () of the semiconductor die () to protruding electrodes () of a semiconductor die (), and seals, using a non-conductive film (NCF) (), a gap between the semiconductor die () and the semiconductor die (). Continuous vacuum suction holes () are provided in the base (), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island ().

Electronic component mounting apparatus

A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.

Electronic component mounting apparatus and the same method thereof

A motion guide device that has a novel damping structure different from the conventional damping structure is provided. The present invention comprises a raceway member () having a rolling-element rolling part (); a moving member () having a loaded rolling-element rolling part () facing the rolling-element rolling part () and being allowed to make a linear or curved movement relatively to the raceway member (); and a plurality of rolling elements () intervening between the rolling-element rolling part () of the raceway member () and the loaded rolling-element rolling part () of the moving part (). A gap () between the raceway member () and the moving member () is filled with a layer of oil contacting the raceway member () and the moving member (). Viscosity resistance of the oil is utilized to apply a braking force to the moving member () or the raceway member () in proportion to a speed.

Motion guide device, table apparatus, and damping method for motion guide device

a ball spline enabling easy machining of a spline shaft by drawing and manufacturable at low cost. The ball spline includes a spline shaft in which multiple lines of ball rolling faces are formed along the longitudinal direction; and a spline nut having a hollow hole for inserting the spline shaft therein, having load rolling faces opposed to the ball rolling faces of the spline shaft. Multiple lines of torque transmission grooves along the longitudinal direction are formed at equal intervals around the spline shaft, and the ball rolling faces are formed on the lateral both sides of these torque transmission grooves. Further, a distance between a pair of ball rows rolling on both sides of the land parts of the spline shaft is set larger than a distance between a pair of ball rows rolling on both sides of the torque transmission grooves.

Ball spline

A motion guide device is provided which comprises a chain of rollers in which retainers are interposed, in which the chain of rollers is given a degree of freedom of rotation. The motion guide device comprises a track member () on which a roller rolling part () is formed which allows rollers () to roll on along the roller rolling part; a moving member () on which a loaded roller rolling part () facing the roller rolling part () is formed; a plurality of rollers () arranged on a roller circulation path containing a loaded roller rolling path () formed between the roller rolling part () of the track member () and the roller rolling part () of the moving member (); and a plurality of retainers () respectively interposed between rollers of the plurality of rollers (). The plurality of retainers () are mutually separated, each of the retainers () which is divided into a first divided member () contacting one roller of a pair of rollers () with each retainer () sandwiched therebetween and a second divided member () contacting the other roller () of the pair of rollers, and the first divided member () is allowed to rotate relative to the second divided member ().

Motion guide device

The present invention provides a screw device which takes a heavy load in one direction along the axis of the screw shaft and only a light load in the opposite direction, the screw device capable of providing ease of control of preloading. The screw device of the present invention has a screw shaftwith an outer surface having a ball rolling groovefor rolling ballsand a roller rolling groovefor rolling rollersboth spirally formed thereon; a ball nutwith an inner surface having a ball rolling groovespirally formed thereon facing the ball rolling grooveof the screw shaft; a roller nutwith an inner surface having a roller rolling groovespirally formed thereon facing the roller rolling grooveof the screw shaft; a plurality of ballsarranged between the screw shaftand the ball nut; and a plurality of rollersarranged between the screw shaftand the roller nut. The ball nutand the roller nutare connected along an axis of the screw shaft

Screw device and method of manufacturing the same

Growing community of inventors

Tokyo, Japan

Satoru Nagai