Matsushita Electric Industrial Co., Ltd.

Satoru Morimoto

Kenji Inoue

Makoto Umetani

Hidenao Kataoka

Shoji Nakamura

Yoshinari Kashiwagi

A die for press-molding glass optical elements comprising (a) a base material having heat resistance and sufficient strength to withstand press-molding of optical glass elements; (b) a film on said base material comprising an alloy film containing B and one metal selected from the group consisting of Ni, Co, and Fe, and one metal selected from the group consisting of Si, Ti, Cu, Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Re, Os, and Ir, to form a cutting layer; and (c) a surface protective layer on top of said cutting layer made of an alloy film comprising at least one metal selected from the group consisting of Pt, Pd, Ir, Rh, Os, Ru, Re, W, and Ta.

Die for press-molding optical elements

A die for press-molding glass optical elements which can press-mold glass optical elements having high melting points and various shapes repeatedly, which includes a base material having high strength on which a cutting layer having heat resistance and free cutting machinability is formed. After cutting the cutting layer into the desired shape with high accuracy, the die is coated with a surface protective film.

Method of manufacturing a die for press-molding optical elements

A method of press-molding glass optical elements by press-molding glass, having a high melting point, at a temperature of 650.degree. C. and higher using a die for press-molding glass optical elements which includes a base material having a heat resistance and sufficient strength to withstand press-molding of optical glass elements, a cutting layer on the base material, and a surface protective layer on the cutting layer. The cutting layer is formed of an alloy film containing P and one metal selected from the group Ni, Co, and Fe, and one metal from the group Si, Ti, Cu, Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Re, Os, and Ir, or an alloy film containing Cu and 20 to 80 atom % of one metal selected from the group Ni, Co, Fe, Si, Ti, Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Re, Os, and Ir, or an alloy film containing Si and 20 to 80 atom % of one metal selected from the group Ni, Co, Fe, Cu, Ti, Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Re, Os, and Ir. The surface protective layer is formed of an alloy film of at least one metal selected from the group Pt, Pd, Ir, Rh, Os, Ru, Re, W, and Ta.

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Tondabayashi, Japan

Satoru Morimoto