Meiko Electronics Co., Ltd.

Meeko Electronics Co., Ltd.

Satoru Miwa

To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off. In manufacturing encapsulated circuit modules, first, a substrateis covered with a first resincontaining filler together with an electronic component. Next, a surface of the first resinis covered with a second resincontaining no filler. Subsequently, a ground electrodein the substrateis exposed by snicking and then a shield layerthat covers the entire surface of the substrateis formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.

Encapsulated circuit module, and production method therefor

To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence, an embodiment provides an encapsulated circuit module M having a substrateon which a number of electronic componentsare mounted. An electronic componentA is a high frequency oscillator. A metal side wallof a partition member is provided on the substrate. One surface of the substrateis entirely covered with a first resintogether with the electronic componentsand the side wall. The first resinis covered with a metal shield layerfor shielding electromagnetic waves. The electronic componentA is surrounded by the side walland the shield layer

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Nagoya, Japan

Satoru Miwa