Sumitomo Electric Hardmetal Corp.

Sumitomo Electric Industries, Limited

National Institute of Advanced Industrial Science and Technology

Satoru Kukino

Katsumi Okamura

Takashi Harada

Naoki Watanobe

Taisuke Higashi

Akito Ishii

Hironari Moroguchi

Tomohiro Fukaya

Michiko Matsukawa

Tetsuo Nakai

Akihiko Ueda

Machiko Abe

Gaku Harada

Yusuke Matsuda

Makoto Setoyama

Junichi Shiraishi

Rintaro Sugimoto

Mayuka Segawa

Hisaya Hama

Mitsuhiro Goto

Shinya Uesaka

Haruyo Fukui

Takashi Kanda

Hisanori Ohara

Takashi Yoshioka

Hideki Moriguchi

Nozomi Tsukihara

Yuh Ishida

Shinya Imamura

Yasuyuki Kanada

Yosuke Shimamoto

Katsuko Yamamoto

Kiyoshi Ogata

Tomoyuki Fukuyama

Kunishige Tanaka

Yoshiharu Utsumi

Kimihiro Ozaki

Yasunobu Ogata

Minoru Yoshida

Yuichiro Watanabe

Yoshihiro Kuroda

Kentaro Chihara

Soichiro Kakinoki

Keita Miyamoto

Mayu Amemiya

Tsutomu Hirano

Yoshinori Tanigawa

Hirotsugu Iwasaki

Yoshiki Asakawa

Masashi Harada

Kenta Sano

Michiko Ota

Kazushi Takahama

Yuki Tsutsumiuchi

Mayu Danda

Aya Yoshimura

Takeru Nakashima

Shinichiro Yurugi

Tomoyuki Ishida

Naoto Okazaki

Takuya Nohara

Kei Hirai

Miki Irie

Minori Teramoto

Keizo Kobayashi

Satoshi Ohtani

Takuma Kishimoto

Teruhiro Enami

Yuka Deguchi

Hideki Tomimoto

Koji Sano

Kento Yamada

Kenichi Kikutani

Yasunori Kobayashi

Katsumi Sumitomo Electric Hardmetal Corp Okamura

Tomohiro Sumotomo Electric Hardmetal Corp Fukaya

A cutting insert includes a rake face, a flank face, and a cutting edge constituted of a ridgeline between the rake face and the flank face. The cutting edge has a first cutting edge portion for corner processing, a second cutting edge portion for low cut-in pulling processing, a third cutting edge portion for high cut-in pulling processing, a fourth cutting edge portion for finished-surface processing, a first connection cutting edge portion, a second connection cutting edge portion, and a third connection cutting edge portion. The fourth cutting edge portion is disposed between the first cutting edge portion and the second cutting edge portion. The second cutting edge portion is disposed between the fourth cutting edge portion and the third cutting edge portion. Each of the first cutting edge portion, the second cutting edge portion, and the fourth cutting edge portion has a curved shape.

Cutting insert and processing method

A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 8.1×10mand less than 1.0×10m.

Diamond sintered material and tool including diamond sintered material

Cutting tool

There is provided a diamond cutting tool including a cutting edge portion containing single crystal diamond or binderless polycrystalline diamond and graphite, wherein when Raman spectroscopy is performed on a surface of the cutting edge portion, a ratio R1 of Ig1 to a sum of Id1 and the Ig1 is equal to or more than 0.5 and equal to or less than 1, where the Id1 represents a peak intensity of first carbon in the surface, the Ig1 represents a peak intensity of second carbon in the surface, the first carbon represents carbon that forms the single crystal diamond or the binderless polycrystalline diamond.

Diamond cutting tool and method for manufacturing the same

A cubic boron nitride sintered material comprises cubic boron nitride particles, a binding phase, and an interfacial phase. The interfacial phase intervenes between the cubic boron nitride particles and the binding phase. The interfacial phase includes aluminum, nitrogen, boron, and oxygen. A total of an average value of the atomic concentrations of aluminum included in the interfacial phase and an average value of the atomic concentrations of nitrogen included in the interfacial phase is 50.0 at % or more. A ratio of an average value of the atomic concentrations of nitrogen included in the interfacial phase to an average value of the atomic concentrations of boron included in the interfacial phase is more than 1.00.

Cubic boron nitride sintered material and cutting tool

A cubic boron nitride sintered material tool contains a plurality of cBN grains. cBN grains located on a surface of the cutting edge contain a cubic boron nitride phase, and a hexagonal boron nitride phase. When a ratio I/Ibetween an intensity of a π* peak derived from a π bond of hBN in the hexagonal boron nitride phase and an intensity of a σ* peak derived from a σ bond of hBN in the hexagonal boron nitride phase and a σ bond of cBN in the cubic boron nitride phase is determined by measuring an energy loss associated with excitation of K-shell electrons of boron, the ratio I/Iof the cBN grain on the surface of the cutting edge is 0.1 to 2, and the ratio I/Iof the cBN grain at a depth position of 5 μm from the surface of the cutting edge is 0.001 to 0.1.

Cubic boron nitride sintered material tool

A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 1.2×10mand less than or equal to 5.4×10m.

A cutting tool comprises a substrate and a coating film disposed on the substrate, wherein the coating film comprises a first layer and a second layer; the first layer has a hardness Hof 25 GPa or more and 40 GPa or less; the second layer has a hardness Hsatisfying 0.5×H≤H≤0.9×H; and at least one of a ratio I/(I+I+I) of Iof (200) plane to a sum of X-ray diffraction intensity Iof (200) plane, X-ray diffraction intensity Iof (111) plane, and X-ray diffraction intensity Iof (220) plane of the coating film, a ratio I/(I+I+I) of Ito the sum, and a ratio I/(I+I+I) of Ito the sum is 0.45 or more.

A cutting tool includes a substrate; and a coating film, wherein the coating film includes a multilayer structure layer having first unit layer(s) and second unit layer(s), the first unit layer(s) and the second unit layer(s) are alternately layered, under a condition X-ray diffraction intensities of different planes in the multilayer structure layer are respectively represented by I, I, and I, the following formula 0.6≤I/{I+I+I}, the first unit layer(s) has a NaCl-like structure in which an interplanar spacing din a c-axis direction is larger than an interplanar spacing din an a-axis direction, the second unit layer(s) has a NaCl-like structure in which an interplanar spacing din the c-axis direction is smaller than an interplanar spacing din the a-axis direction, and the following formulas are satisfied as well 1≤d/d≤1.02, 1.01≤d/d≤1.05, and d/d<d/d.

A diamond tool includes a diamond at least on a cutting edge includes a diamond phase composed of a diamond crystal structure and a graphite phase composed of a graphite crystal structure. When a ratio I/Ibetween an intensity of a π* peak derived from a π bond of carbon in the graphite phase and an intensity of a σ* peak derived from a σ bond of carbon in the graphite phase and a σ bond of carbon in the diamond phase is determined for the diamond grain by measuring an energy loss associated with excitation of K-shell electrons of carbon by electron energy loss spectroscopy, the ratio I/Iof the diamond grain on a surface of the cutting edge is 0.1 to 2 and a ratio I/Iof the diamond grain at a depth position of 0.5 μm from the surface of the cutting edge is 0.001 to 0.1.

Diamond tool

A diamond coated tool includes a base material and a diamond layer provided on the base material. The diamond layer has a boron content of 1×10ppma or more and 1×10ppma or less and an oxygen content of 1×10ppma or more and 1×10ppma or less in a first region surrounded by a surface of the diamond layer and a first imaginary plane located at a distance of 1 μm from the surface in a thickness direction.

Diamond coated tool

A cutting tool rotates about a rotation axis, and includes a tip end portion. The tip end portion includes a partially spherical surface that is brought into contact with a workpiece. The surface is provided with a plurality of recesses disposed apart from each other. An opening edge of each of the plurality of recesses constitutes a cutting edge.

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Itami, Japan

Satoru Kukino