Fujikoshi Machinery Corp.

Fujikoshi Kikai Kogyo Kabushiki Kaisha

Fujikoshi Kakai Kogyo Kabushiki Kaisha

Satoru Kitta

Yoshio Nakamura

Yasuhide Denda

Atsushi Kajikura

Yoshio Otsuka

Masanori Furukawa

Toshiaki Seki

Takuya Kakegawa

Kiyokazu Gonda

The disk edge polishing machine is capable of polishing an inner edge of a center hole of a disk and an outer edge thereof. In the disk edge polishing machine, a sucking member has a cylindrical end section. The sucking member sucks the disk by the cylindrical end section and exposes the inner edge and the outer edge of the disk. The sucking member spins together with the disk. An outer polishing member polishes the outer edge of the disk. An inner polishing member is inserted into the center hole and simultaneously polishes the inner edge of the disk. A first driving mechanism relatively moves the outer polishing member and the sucking member close to and away from the outer edge of the disk along a predetermined course. A second driving mechanism relatively moves the inner polishing member and the sucking member close to and away from the inner edge of the disk along another predetermined course extended from the predetermined course.

Disk edge polishing machine and disk edge polishing system

The object of the invention is to provide a polishing machine, which are capable of making the degree of plane higher. The polishing machine comprises: a polishing plate for polishing a work, which is pressed thereon, the polishing plate being capable of rotating; and a driving mechanism for rotating the polishing plate, characterized in that the driving mechanism is capable of rotating the polishing plate in one direction and the other direction. In the polishing machine, since the work is polished by rotating the polishing plate in the one direction, then rotating it in the other direction, slury concentrated at a specific position of the work can be scattered, so that the work can be polished uniformly and the degree of plane can be higher.

Polishing machine and a method of polishing a work

In an apparatus for lapping a wafer material, e.g., a semiconductor silicon wafer, by bonding the wafer to the lower surface of a pressing plate, mounting the pressing plate on a turn table to bring the wafer into contact with the turn table and pressing the pressing plate downwardly with a downwardly opening cup-like top ring mounted thereon, the pressing plate is pressed down not directly with the top ring alone but pressed through a rubber membrane covering the downward opening of the top ring and pressurized with compressed air under pressure regulation so that the lapping pressure on the wafer surface can be very uniform and the thus lapped wafer is excellent in respect of the flatness of each lapped surface and parallelism between lapped surfaces.

Method for lapping a wafer material and an apparatus therefor

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Nagano, Japan

Satoru Kitta