Idemitsu Petrochemical Co., Ltd.

Idemitsu Kosan Company, Limited

Lion Idemitsu Composites Co., Ltd.

Satoru Kinouchi

Tomoyoshi Murakami

Shigemasa Suzuki

Naoto Okubo

Yutaka Tsubokura

Provided is a polyarylene sulfide resin composition which is good in strength, dimensional stability, and moldability in terms of a molded body thereof and is also capable of reducing wearing of a mold or molding machine at the time of molding of a molded body. The polyarylene sulfide resin composition contains 100 parts by mass of a polyarylene sulfide resin and 150 to 400 parts by mass of a glass bead, a sodium content of the polyarylene sulfide resin being 1,200 ppm or less, and the glass bead being surface-treated with a vinylsilane or an epoxysilane and having an average particle diameter of 30 &#x3bc;m or less and a ratio between a cumulative 10% particle diameter and a cumulative 90% particle diameter {(cumulative 90% particle diameter)/(cumulative 10% particle diameter)} of 2.5 or more.

Polyarylene sulfide resin composition and use of same

A resin composition for encapsulating an electronic tag which includes a thermoplastic resin and a flat glass fiber and does not include a thermoplastic elastomer, wherein the thermoplastic resin is at least one selected from polycarbonate, syndiotactic polystyrene and polyphenylene sulfide.

Resin composition for encapsulating an electronic tag, a resin-encapsulated electronic tag and a method for producing the same

Provided is a polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and/or (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C). The composition has good PCT and TCT acceptable quality and good fluidity, naturally having good properties intrinsic to ordinary PAS resin, and which, when used for sealing electronic parts, causes neither deformation of bonding wires and other elements nor package breakdown, and is therefore favorable to materials for sealing electronic parts.

Polyarylene sulfide resin composition for electronic parts encapsulation

A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) an aliphatic or saturated cyclic polycarbodiimide resin or a precursor thereof, and preferably (C) reactive silicone compound grains, and (D) a polyethylene naphthalate resin or (E) a filler, which improves excellent properties exhibited by polyarylene sulfide resins, and which is also endowed with an excellent adhesion characteristics to adhesives such as epoxy resins. In addition, a molded article obtained by molding a polyarylene sulfide resin composition endowed with such excellent properties is useful as a container for accommodating an electric component material. Such a molded article may also be used as an electronic component having conductive portions which are totally or partially accommodated in the container, wherein the conductive portions are seled by a sealant encapsulated in the container.

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Chiba, Japan

Satoru Kinouchi