Denki Kagaku Kogyo Kabushiki Kaisha

Satoru Kawata

Takeshi Saito

Tomomichi Takatsu

In a conventional adhesive sheet laminated with a die attachment film, the die attachment film sometimes drops off from the die chip at the time of pick-up after die chip formation by dicing a wafer. The present invention provides an adhesive including a (meth)acrylate ester polymer, a urethane acrylate oligomer having 4 or more vinyl groups, and silicone microparticles. Another aspect of the invention, provides a process for producing electronic components, the process including: a wafer-pasting step of pasting a wafer on a surface of a die attachment film of an adhesive sheet; a dicing step of dicing the wafer into die chips; and a pick-up step of peeling the die attachment film from the adhesive layer after the dicing step, and picking up the die chip together with the die attachment film.

Adhesive, adhesive sheet, and process for producing electronic components

An adhesive sheet and a method for producing electronic components using the sheet are provided. An adhesive sheet comprising a substrate layer; an antistatic layer formed on one surface of the substrate layer and containing an organic binder, an antistatic agent, an antifriction agent and a curing agent; and an adhesive layer formed on the other surface of the substrate layer; and a method for producing electronic components using the adhesive sheet.

Growing community of inventors

Shibukawa, Japan

Satoru Kawata