Kyocera Corporation

Satoru Kamitani

Shigenobu Nakamura

Takeshi Okamura

Masaki Terazono

Kiyoshi Yokoyama

A sample holder includes: a ceramic substrate including one main surface serving as a sample holding surface; a heat-generating resistor located inside or on an other main surface of the ceramic substrate; a metal member having a first surface bonded to, by a bonding layer, and covering the other main surface of the ceramic substrate, the metal member including a through hole penetrating from the first surface to an opposite surface of the metal member; a lead terminal inserted into the metal member; and a conductive portion located inside the bonding layer, the conductive portion electrically connecting the heat-generating resistor and the lead terminal, the conductive portion including a region which extends in a same direction as the other main surface, and separate from the other main surface of the ceramic substrate.

Sample holder

A ceramic base body, which is a ceramic heater which suppresses noise radiation and thus has little adverse effect on surrounding electronic devices, includes a plurality of ceramic layers, and a mixed-material layer disposed between two ceramic layers, the mixed-material layer being formed of a mixture of a ceramic material and a metal material. Between the ceramic layer and the mixed-material layer, a heat-generating resistor which generates heat by a passage of electric current therethrough is disposed. Radiation of a high-frequency component generated by the passage of electric current through the heat-generating resistor is suppressed by the mixed-material layer, wherefore the adverse effect of the radiation on surrounding electronic devices can be reduced.

Ceramic heater

An acoustic generator according to one embodiment includes an exciter, a vibrating portion, a frame, and a lead. The exciter receives an input of an electrical signal and is caused to vibrate. The exciter is mounted on the vibrating portion, and the vibrating portion is caused to vibrate by the vibration of the exciter. The frame is provided on an external circumferential portion of the vibrating portion, and supports the vibrating portion substantially flat. The lead is connected to the exciter, and inputs an electrical signal to the exciter. The frame includes a terminal serving as a connection point to the lead.

Acoustic generator, acoustic generation device, and electronic device

An object is to provide a preferable frequency characteristic of a sound pressure. For achieving the object, an acoustic generator according to an embodiment includes a piezoelectric element (exciter), a flat vibration plate, and a frame body. The piezoelectric element receives input of an electric signal and vibrates. The piezoelectric element is attached to the vibration plate, and the vibration plate vibrates together with the piezoelectric element with the vibration of the piezoelectric element. The frame body is provided on an outer circumferential portion of the vibration plate. Corners on an inner circumferential surface of the frame body include at least curved surfaces, and at least one of the corners has a shape different from the shape of the other corners.

An acoustic generator disclosed herein includes: an exciter which vibrates by an electric signal being input; and a film-shaped vibrating body to which the exciter is bonded via a bonding material and which vibrates together with the exciter by the vibration of the exciter, wherein the bonding material has a protruded part which protrudes from an outer edge of the exciter when the vibrating body is viewed in plane, at least a part of the protruded part has an undulating shape so as to be different from a shape of the outer edge of the exciter, and a part without the bonding material is provided between the exciter and the vibration body.

Acoustic generator, acoustic generation device, and electronic apparatus

An electrostatic chuck having a good soaking feature and allowing a wafer to reach a saturation temperature quickly is provided. The chuck, which has a platy body with a pair of main surfaces, one main surface being used as a mounting surface for mounting a wafer, and an attracting electrode on the other main surface or inside the body, has at least one gas introducing through hole formed so as to pass through the body, a gas flow path formed in the mounting surface by a plurality of mutually separated protrusions and formed so as to communicate with the through hole, and an annular wall portion formed on the outer periphery of the body, characterized in that the planar shape of each of the above protrusions consists of four sides and arc-shaped portions connecting the four sides, and the above protrusions are uniformly arranged on the mounting surface.

Electrostatic chuck

In an electrostatic chunck with grooves formed on the dielectric layer surface, the rate of foreign matter adhering to the semiconductor wafer is reduced and at the same time the semiconduticor wafer can be uniformly heated without causing leakage of lie or other gases supplied to the grooves of the said holding surface into the chamer. The electrostatic chuck is composed of a dielectric layer made from ceramics or sapphire which has electrostatic electrodes, holding surface positioned on a same plane and concave spaces positioned next to the holding surface, at least one of the said holding surface being circumference, and the outermost such holding surface having a width of 1-20 .mu.m and being a smooth surface having a center line average roughness (Ra) of 0.3 .mu.m or less.

Growing community of inventors

Kirishima, Japan

Satoru Kamitani