Mitsubishi Electric Corporation

Mitsubishi Heavy Industries Limited

Janome Sewing Machine Company Limited

Hitachi, Ltd.

Jx Nippon Oil Energy Corporation

Nidec Copal Corporation

Satoru Ishikawa

Takashi Matsunaga

Shohei Ogawa

Takaaki Oshima

Takumi Shigemoto

Shinichi Sato

Junji Fujino

Akira Orii

Michio Hisatake

Yuki Yano

Toshinobu Sakamoto

Takaaki Suzuki

Masayuki Takase

Masaya Endo

Yuji Imoto

Kiyoshi Arai

Shinsuke Asada

Akira Tsubokura

Kazuaki Hirasawa

Yusuke Ishiyama

Isao Oshima

Tomoyuki Iijima

Tetsuya Miyamoto

Junnosuke Wakai

Toshitaka Toyomi

Tomoyuki Ishizaki

Tadashi Sugimura

Tetsuji Hoshino

Yoshito Ando

Kazuhisa Osada

An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.

Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device

An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.

Semiconductor device comprising a lead electrode including a through hole

From among a U-plane and a C-plane, the U-plane is installed in a first user site which has a base station, and the C-plane is installed in a C-plane site (any site that is not a user site). A system sets a U-plane inter-site path which is an inter-site communication path that connects a first user site with a second user site via a wide area network, and a C-plane inter-site path which is an inter-site communication path that connects a C-plane site with the first user site via the wide area network. In addition, the system sets an in-site communication path which is a communication path within the first user site and which connects to an inter-site communication path. A U-plane inter-site path is an inter-site communication path via which data is transmitted or received by a U-plane. A C-plane inter-site path is an inter-site communication path via which a signal is transmitted or received by a C-plane.

Communication support system and method

A semiconductor element bonding substrate according to the present invention includes an insulating plate, and a metal pattern bonded to a main surface of the insulating plate. A main surface of the metal pattern on an opposite side of the insulating plate includes a bonding region to which a semiconductor element is bonded by a solder. The metal pattern includes at least one concave part located in the main surface. The at least one concave part is located closer to an edge of the bonding region in relation to a center part of the bonding region in the bonding region.

Semiconductor element bonding substrate, semiconductor device, and power conversion device

A semiconductor device includes an insulating substrate formed by integrating a ceramic base plate and a cooling fin; a multiple of plate interconnection members; and a plurality of semiconductor elements. The one faces of the semiconductor elements are bonded to the ceramic base plate of the insulating substrate with a chip-bottom solder, and the other faces thereof are bonded to the plate-interconnection members with a chip-top solder so that plate interconnection members correspond respectively to the semiconductor elements. The chip-bottom solder and the chip-top solder both contain mainly Sn and 0.3-3 wt. % Ag and 0.5-1 wt. % Cu. This allows the semiconductor device to be reduced in size without impairing heat dissipation.

Semiconductor device and method for producing semiconductor device

In a method for manufacturing a semiconductor device, a plurality of first provisional fixing portions are supplied on a front surface of a substrate such that the plurality of first provisional fixing portions are spaced from each other and thus dispersed. A first solder layer processed into a plate to be a first soldering portion is disposed in contact with the plurality of first provisional fixing portions. A semiconductor chip is disposed on the first solder layer. In addition a conductive member in the form of a flat plate is disposed thereon via a second provisional fixing portion and a second solder layer. A reflow process is performed to solder the substrate, the semiconductor chip and the conductive member together.

Semiconductor device, method for manufacturing the same, and power conversion device

The semiconductor device includes a semiconductor element substrate having an insulation property, and a wire for positioning the semiconductor element with respect to the semiconductor element substrate. The semiconductor element substrate includes a disposition region for disposing the semiconductor element. The wire is provided at least at a part of the periphery of the disposition region.

Semiconductor device, power conversion apparatus, and method for manufacturing semiconductor device

This amphibious vehicle is provided with a body (), a traveling device () that causes the body () to travel on land, a sailing device () that causes the body () to sail on water, a front flap () of which the distal end is inclined upward and the proximal end is rotatably supported by a horizontal shaft () on the front end of the body (), a hydraulic damper () serving as a damping member that damps displacement of the front flap () relative to the body (), and a compression coil spring () serving as a restoring member that restores the position of the front flap () relative to the body ().

Amphibious vehicle

An amphibious vehicle, which enables wave making resistance upon traveling on water to be reduced and propulsive performance of its vehicle main body to be improved, is to be provided. An amphibious vehicle of the present invention includes: a vehicle main body that is movable on water and on land; a rear portion flap having a front end portion fixed to a rear portion of the vehicle main body; and end plates respectively provided at both side end portions of the rear portion flap.

An amphibious vehicle that can reduce wave drag at the time of hydroplaning and can improve propulsion performance of the vehicle body. The amphibious vehicle includes a vehicle body capable of moving on water and on land, a front flap with a rear end being fixed to a lower end of the vehicle body, a rear flap with a front end being fixed to a rear part of the vehicle body, and a pair of keels provided along a travel device provided on both sides of the vehicle body on a bottom surface of the vehicle body.

The objective of the present invention is to provide an amphibious vehicle and a method of controlling the attitude of the vehicle body of an amphibious vehicle, with which it is possible to reduce the fluid resistance when traveling on water and to improve the propulsion performance of the vehicle main body. An amphibious vehicleaccording to the present invention is characterized in being provided with: a vehicle main bodycapable of moving on water and on land; a rear flapB provided at the rear of the vehicle main body; a drive unitwhich drives the rear flapB to vary a flap angle &#x3b8;between the vehicle main bodyand the rear flapB; a detecting unitwhich detects a trim angle of the vehicle main body, a vehicle speed and the flap angle &#x3b8;; and a control unitwhich controls the flap angle &#x3b8;on the basis of the trim angle, the vehicle speed and the flap angle &#x3b8;detected by the detecting unit

Amphibious vehicle and method of controlling attitude of vehicle body of amphibious vehicle

A vibration actuator includes: a coil having a vibration space along an axial direction; an outer case that covers the coil and that extends the vibration space in the axial direction; a movable element that comprises a magnet that vibrates within the coil and a weight unit that vibrates within the outer case and that is connected to one end side, in the axial direction, of the magnet; and an elastic member that supports elastically the vibration of the movable element in the axial direction. A resin layer is secured to an outer peripheral surface of the weight unit that faces an inner surface of the outer case. An oil film is interposed between the resin layer and the inner surface of the outer case.

Vibration actuator

A method for producing a composition containing carotenoid at a content of 80% or greater, characterized in performing extraction on a culture of a microorganism, a concentrate of the culture, or a dried substance thereof with at least one selected from the group consisting of lower alcohols, water-containing lower alcohols, lower dialkylketones and ethers; and then washing a precipitate, obtained by concentrating the extract solution, with at least one selected from the group consisting of lower alcohols, water-containing lower alcohols, hydrocarbon-based solvents and lower dialkylketones; and food, a pharmaceutical composition or a cosmetic substance comprising the carotenoid-containing composition.

Process for production of carotenoid

Disclosed is the invention in connection with an electric sewing machine comprising a machine bodyand a controller, wherein the controlleris responsive to a first press to produce a signal for starting the machine bodyand is responsive to further press to produce a signal for driving the machine bodyat a stitching speed (drive speed) in accordance with the pressing amount. The machine bodyis provided with a control devicewhich is connected to a changing devicewhich is operated to change the control content of the control device. The changing devicemay be operated to switch the control devicebetween being operative and being inoperative. In case the control deviceis switched to being inoperative, the control deviceneglects the instruction signal from the controller, for example, produces a stop signal to a motor drive devicein response to a machine drive signal from the controller, thereby to maintain the machine motor as stopped. Therefore, if the changing deviceis selectively operated beforehand to switch the controllerto being inoperative, the machine bodywill not driven in response to the instruction signal from the controllerwhich may be wrong operated. Thus the safety may be secured.

Electric sewing machine

A ship has a main propellerwhich can move the ship forward and reverse by normal rotation, reverse rotation or by changing the pitch angle. A drive unit drives the main propeller. A rudderchanges the course of the ship. At least one pod propulsion unitA,B is provided. As a result, the support mechanism and the turning mechanism of the pod propulsion unit, arranged separate from the main propeller, can be simplified and cost can be reduced.

Growing community of inventors

Tokyo, Japan

Satoru Ishikawa