Showa Denko K.k.

Satoru Ishigaki

Hiroshi Uchida

Yutaka Yokoyama

Katsutoshi Morinaka

Zenichiro Izumi

Yoshio Miyajima

Yukihiro Hisanaga

Kouichi Yamamoto

There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1):CH&#x2550;CH&#x2014;COO&#x2014;R&#x2014;NCO&#x2003;&#x2003;(1)(wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).

Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same

A thermoplastic resin composition having good coating affinity is disclosed, which comprises (a) from 20 to 80 parts by weight of a resin component containing a modified polyolefin resin which has been graft-modified with an unsaturated hydroxy group-containing compound or an unsaturated carboxylic acid, (b) from 80 to 20 pats by weight of a rubber component containing a copolymer rubber, and (c) a functional group-terminated oligomer in an amount of from 0.1 to 20 parts by weight per 100 parts by weight of the sum of components (a) and (b).

Thermoplastic resin composition and paint-coated molded product thereof

Growing community of inventors

Kawasaki, Japan

Satoru Ishigaki