Kabushiki Kaisha Toshiba

Satoru Hara

Masayuki Uchida

Takashi Togasaki

Shuzo Akejima

Kentaro Suga

According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.

Semiconductor apparatus and method for manufacturing the same

A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Growing community of inventors

Kanagawa-ken, Japan

Satoru Hara