Canon Kabushiki Kaisha

Canon Precision Inc.

Satoru Hamasaki

Koichi Shimizu

Hisatane Komori

Koji Tsuduki

Shuichi Chiba

Tadashi Kosaka

Kazuya Notsu

Yu Katase

Yasuhiro Matsuki

Takanori Suzuki

Masahiko Igaki

Chihiro Nagura

Hiraku Kozuka

Makoto Ogura

Ikuo Watanabe

Ikuto Kimura

Yasuji Yokoyama

Tsutomu Nagao

A head mounted display includes a display device having a display surface, an optical system configured to adjust a focal point of an eye of an observer to the display device, a driving mechanism configured to drive the display device, a line-of-sight detector configured to detect a line of sight of the observer, and a controller configured to control, based on an output from the line-of-sight detector, the driving mechanism so that an angle formed by the line of sight and the display surface falls within a preset allowable range with respect to 90° at an intersection point of the line of sight and the display surface.

Head mounted display and cross reality system

A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.

Method of manufacturing package unit, package unit, electronic module, and equipment

Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.

Electronic module and imaging system

According to the disclosure, a relationship of Tgp&#x3e;Tgf, &#x3b1;f1&#x3c;&#x3b1;PCB1, and (Tgp&#x2212;To)&#xd7;&#x3b1;PCB1&#x3c;(Tgf&#x2212;To)&#xd7;&#x3b1;f1+(Tgp&#x2212;Tgf)&#xd7;&#x3b1;f2 or a relationship of Tgp&#x3c;Tgf, &#x3b1;PCB1&#x3c;&#x3b1;f1, and (Tgf&#x2212;To)&#xd7;&#x3b1;f1&#x3c;(Tgp&#x2212;To)&#xd7;&#x3b1;PCB1+(Tgf&#x2212;Tgp)&#xd7;&#x3b1;PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as &#x3b1;PCB1 and &#x3b1;PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as &#x3b1;f1 and &#x3b1;f2, respectively, and a room temperature is denoted as To.

Imaging device module, imaging system, imaging device package, and manufacturing method

A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.

Solid-state imaging apparatus, method of manufacturing same, and camera

Provided is a rotary encoder, including: a rotary scale, which has a predetermined pattern including continuous patterns and a rotational angle original point formed thereon with reference to a pattern center, has a polygonal outer shape, and has the rotational angle original point defined with reference to at least one side of sides of the polygonal outer shape; a hub, which includes projections for abutting the sides of the polygonal outer shape of the rotary scale and positioning the rotary scale; a rotating shaft, which is press-fitted into the hub and rotates coaxially with the pattern center of the rotary scale; and detecting units for irradiating the rotary scale with light and detecting the light reflected by the rotary scale.

Rotary encoder and method of assembling the same

A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies Htan(&#x3b8;A&#x2212;2&#x3b8;C)&#x2266;LLat any point on the upright surface, and H tan(&#x3b8;A&#x2212;2&#x3b8;B)+(H)tan &#x3b8;B&#x2266;Land &#x3b8;B&#x3e;&#x3b8;C at any point on the non-vertical surface, where &#x3b8;A is the inclination of incident light, &#x3b8;B is the inclination at a point on the non-vertical surface, &#x3b8;C is the inclination at a point on the upright surface, His the height of the non-vertical surface, His the height of the upright surface, H is the height of the frame portion, Lis the distance from the edge of a pixel region to the upper edge of the upright surface, and Lis the distance from the upper edge to the lower edge of the upright surface in the planar direction.

Solid-state image pickup device

A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.

Growing community of inventors

Yamato, Japan

Satoru Hamasaki