Kyocera Corporation

Satoru Hamano

Hideto Yonekura

Yoshitake Terashi

Masamitsu Onitani

Takahiro Matsuoka

A glass-ceramic sintered body containing Si, Al, Zn, element of Group 2a and Group 4a of the periodic table, and Boron and Oxygen, as constituent elements, and comprising a glass phase and crystalline phases, wherein the crystalline phase comprises a first crystalline phase of a composite oxide containing at least Si, Al and Ca or Sr, or, Si, Al, Ca and Sr, a second crystalline phase of ZrO.sub.2 crystalline and a third crystalline phase of spinel crystalline is presented. The glass-ceramic sintered body has a high dielectric constant of not smaller than 8.5 and have a fracture strength of not smaller than 20 kg/mm.sup.2 and preferred as an insulation substrate of a circuit board, a substrate board for mounting an integrated circuit or an electronic compornent part.

Glass-ceramic sintered body

A glass-ceramic sintered body comprising an SiO.sub.2 --Al.sub.2 O.sub.3 --MgO--ZnO--B.sub.2 O.sub.3 type crystalline glass and alumina, said sintered body containing at least 10% by weight of a spinel crystalline phase; and a substrate composed of the sintered material. There is also provided a process for producing the glass-ceramic sintered body which comprises adding a binder to a mixed powder of an SiO.sub.2 --Al.sub.2 O.sub.3 --MgO--ZnO--B.sub.2 O.sub.3 type crystalline glass and alumina, molding the mixture into a predetermined shape, and firing the mixture into a predetermined shape, and firing the molded mixture at a temperature of 925.degree. to 1000.degree. C. in a non-oxidizable atmosphere. The glass-ceramic sintered body and the substrate composed of it in accordance with the present invention have excellent mechanical strength and thereby have markedly increased metallizing adhesion strength.

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Kokubu, Japan

Satoru Hamano