Hitachi, Ltd.

Hitachi Cable, Inc.

Satoru Ezaki

Kiyofumi Tanaka

Yasuo Nakagawa

Kenichi Kasai

Mitugu Shirai

Hiroshi Makihira

Tsutomu Imai

Takeshi Yamaguchi

Tositada Netsu

Hideki Watanabe

Souhei Ikeda

Tsukasa Kasahara

Osamu Harada

Tetsuro Nakagawa

Tetsuya Hirose

Takanori Satoh

Tatsumi Shibata

Fumio Imahashi

A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.

Surface mounting structure

An apparatus for removing an electronic device from a printed circuit board includes a board support for supporting the printed circuit board with the first main surface thereof directed upwardly and for vertically moving the printed circuit board; a lower heating device for applying heat from the second main surface side of the printed circuit board; an upper heating device for applying heat from the first main surface side of the printed circuit board; a withdrawal device disposed on the first main surface side of the printed circuit board for applying a force to withdraw the electronic device from the printed circuit board, the withdrawal device detecting the withdrawal of the electronic device; and a solder elimination device disposed on the first main surface side of the printed circuit board, the solder elimination device comprising a hood for covering that portion of the printed circuit board where the electronic device is mounted, and a pressure control device for increasing or decreasing a pressure within an internal space of the hood to drive the solder out of the through holes by pressurization or suction.

Apparatus for removing electronic device from printed circuit board

According to the method for terminating a cable and the apparatus used therefor of the present invention, first the thermosetting resin layer of the cable is heat-cured, for example, by laser beam. The heat-cured thermosetting resin layer is lowered in stress and strain at rupture and hence can be easily cut and then this thermosetting resin layer is cut and peeled off.

Method for terminating cables and apparatus therefor

An apparatus for forming and cutting a flat type multi-core cable is disclosed, in which core conductors of a flat type multi-core cable, whose core conductors are previously exposed by exfoliating a part of a jacket therefor, are divided into a plurality of units; the core conductors are formed and cut separately for every unit; and at the same time the pitch of the core conductors is corrected. Further the number and/or the pitch of the core conductors are calculated by using information obtained by the scanning of the core conductors and cables, for which the number of the core conductors is not in agreement with predetermined one, or cables, for which errors in the pitch of the core conductors exceed a certain limit, are excluded as deficiencies.

Method for forming and cutting a flat type multi-core cable and

Disclosed is a shape detecting apparatus comprising a slit projector for projecting a slit bright line on a number of objects arrayed in a line, an image forming lens for forming the bright line image, an image scanning mechanism for the bright line image formed through the image forming lens in a height direction of the object and a one-dimensional image sensing device for self-scanning the bright line image formed therein with an array of image sensing elements orthogonal to the scanning direction by the image scanning mechanism.

Shape detecting apparatus

Growing community of inventors

Hadano, Japan

Satoru Ezaki