Kabushiki Kaisha Toshiba

Toshiba Medical Systems Corporation

Satoru Asagiri

Takeshi Miyagi

Takashi Togasaki

Michiko Ooishi

Izuru Komatsu

Michito Nakayama

Takayuki Yamazaki

Yasuyuki Ito

Masayoshi Yamaguchi

Kyoko Kato

Mayumi So

A housing according to the embodiment includes a lower surface part, an upper surface part, and a side surface part. The lower surface part includes a contact surface contacting an adherend. The upper surface part is separated in a vertical direction from the lower surface part with a first space interposed. The side surface part is provided around the first space and is connected to the upper surface part and the lower surface part. The upper surface part and the side surface part include a first material. The lower surface part includes a second material that is softer than the first material. A portion that includes the second material is exposed for at least a portion of the contact surface.

Housing, electronic device, method for manufacturing housing, and method for manufacturing electronic device

According to an embodiment, a detector pack includes a first substrate, an X-ray detection unit, a second substrate, and a data acquisition device. The first substrate includes a first main surface and a second main surface. The X-ray detection unit is provided in the first main surface, converts an X-ray into an electrical signal, and outputs the electrical signal. The second substrate includes a third main surface and a fourth main surface and is disposed in a posture of making the third main surface face the second main surface. The data acquisition device is provided in at least any one of the third main surface and the fourth main surface.

Detector pack and X-ray CT apparatus

In one embodiment, a control module manufacturing method includes disposing a board, on which electronic components are mounted, in a case includes a top opening, injecting a filler into the case, pressing the filler from the surface side thereof by means of a jig, which comprises an upwardly convex hollow portion corresponding to taller ones of the electronic components with respect to the board and covers the opening and curing the filler.

Control module manufacturing method

According to one embodiment, a radioactive ray detecting apparatus includes: a scintillator that produces visible light from a radioactive ray; a light detecting portion including a light receiving element that generates an electrical signal on a basis of intensity of visible light; a first board; a first electrical connection unit that electrically connects the light detecting portion and a first surface of the first board to each other; a second board disposed to face the first board; a second electrical connection that electrically connects a first surface of the second board and a second surface of the first board being opposite from the first surface of the first board to each other; and a data acquisition device that processes an electrical signal transmitted from the light detecting portion through the first electrical connection unit, the first board, the second electrical connection unit, and the second board.

Radioactive ray detecting apparatus, method of manufacturing the same, and imaging system

An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.

Ultrasonic transducer and fabricating the same

An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.

Ultrasonic probe and method for manufacturing ultrasonic probe

In a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising a resin-based binder mixed with filler, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet type adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using isotropic conductive adhesive comprising conductive high polymer material, the isotropic conductive adhesive is supplied to the electrodes on the printed circuit board by an ink jet adhesive coating device. Also, in a method of mounting an electronic component by connecting leads of an electronic component and electrodes on a printed circuit board using anisotropic conductive adhesive comprising a resin-based binder mixed with filler, the electronic component is mounted on the printed circuit board using the anisotropic conductive adhesive which shrinks and cures by heating so as to electrically and mechanically connect the leads and electrodes.

Growing community of inventors

Yokohama, Japan

Satoru Asagiri