Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Other

Hitachi Metals, Ltd.

Hitachi Cable, Inc.

Hitachi Industrial Equipment Systems Co., Ltd.

Hitachi Powdered Metals Co., Ltd.

Satoru Amou

Shinji Yamada

Akira Nagai

Akio Takahashi

Takao Ishikawa

Takao Miwa

Hiroshi Shimizu

Tomiya Abe

Kenichi Murakami

Masao Suzuki

Tokihito Suwa

Mineo Kawamoto

Shiro Kobayashi

Hiroaki Komatsu

Akinori Hanawa

Masashi Miyazaki

Mitsuo Yokota

Hiroyuki Fukai

Yoshihiro Nakamura

Nobuyuki Minami

Takashi Naito

Hiroki Yamamoto

Haruo Akahoshi

Akio Mukoh

Takuya Aoyagi

Shin Nishimura

Shinichi Tachizono

Yuji Hashiba

Kei Yoshimura

Masahiro Suzuki

Daisuke Shanai

Masanori Nemoto

Morimichi Umino

Yoshinori Kawai

Keiichi Kanazawa

Hiroshi Nakano

Toshiya Satoh

Masahiko Ogino

Toshihide Nabatame

Hiroyuki Kagawa

Shuichi Ohara

Masatoshi Sugimasa

Takahito Muraki

Tomokazu Tanase

Shinichi Akasaka

Yasuhiro Murai

Masatoshi Narahara

Kosuke Kuwabara

The present invention provides an epoxy-vinyl copolymerization type liquid resin composition and a cured product of the same. The resin composition contains: an epoxy resin having an epoxy resin equivalent of not more than 200 g/eq; an acid anhydride having an unsaturated double bond that is liquid at normal temperature or the acid anhydride having an unsaturated double bond that is liquid at normal temperature and maleic anhydride; a polyfunctional monomer which is liquid at normal temperature; an epoxy resin curing catalyst which accelerates a curing reaction of the epoxy resin with the acid anhydride or with the acid anhydride and maleic anhydride; and a radical polymerization catalyst which accelerates a curing reaction of the polyfunctional monomer.

Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product

The present invention provides an organic-inorganic composite material having excellent thermal stability, electrical insulation and adhesiveness. The organic-inorganic composite material includes a resin composed of a triazine ring and obtained by thermally curing a varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a curing catalyst for a cyanate ester compound and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound. The invention also provides a varnish which gives the organic-inorganic composite material, and an electrical device and a semiconductor device, each of which includes the organic-inorganic composite material.

Organic-inorganic composite materials containing triazine rings and electrical devices using the same

Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same

Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.

Adhesive composition, varnish, adhesive film and wiring film

An electric equipment of the present invention has an insulation structure at a welding part formed by joining end parts of a plurality of conductors with each other, the welding part having a rectangular cross section and being coated with an insulating coating, in which the insulating coating is voidless and has a coating thickness of 50 to 1000 &#x3bc;m in the welding part, and in which an edge cover ratio of the insulating coating is 20% or more. According to the present invention, the insulation performance of the insulation structure in which the welding part formed by joining the end parts of the plurality of conductors with each other can be improved, the welding part having a rectangular cross section and being coated with an insulating coating, and a highly reliable electric equipment can be provided.

Electric equipment having insulation structure at welding parts

A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380&#xb0; C. or lower.

Low softening point glass composition, bonding material using same and electronic parts

An adhesive composition includes a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin. The maleimide compound has a plurality of maleimide groups in a structure and is at least one of a first maleimide compound having a melting temperature of 160&#xb0; C. or lower and a gelling time at 200&#xb0; C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160&#xb0; C. or lower and a gelling time at 250&#xb0; C. of 110 to 150 seconds. A heat resistant adhesive film may be formed by coating the adhesive composition on a substrate film, and a wiring film may have a conductor wiring layer put between such heat resistant adhesive films.

Adhesive composition, adhesive film and wiring film using the same

There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of Rs is a hydrogen atom or a hydrocarbon group, each of R, Rand Ris a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof

It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.

Prepreg and printed wiring board using thin quartz glass cloth

A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100&#xb0; C. is 50 ppm/&#xb0; C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.

Prepreg and its application products for low thermal expansion and low dielectric tangent

It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same. This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80&#xb0; C. to 140&#xb0; C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170&#xb0; C. to 230&#xb0; C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.

Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition

There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 &#x3bc;m.

Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish

According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, Ris hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof

A thin film capacitor comprising a lower electrode formed on a predetermined surface, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, wherein the end portion of the lower electrode is further covered by an insulator other than the dielectric layer.

Thin film capacitor and electronic circuit component

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Hitachi, Japan

Satoru Amou