Asm Technology Singapore Pte Ltd

Sathish Kumar Balakrishnan

Srikanth Narasimalu

Ka Shing Kenny Kwan

Chee Tiong Lim

Kumaresh Govindan Radhakrishnan

Shu Chuen Ho

Keng Yew James Song

Lian Hok Tan

Boon June Yeap

Wen Ge Tu

Shi Jie Chen

Ning Ying

HongLiang Lu

Lin Ji

Murali Saranagapani

A transfer device for holding an object comprises: i) a housing; ii) at least one inlet conduit having an inlet for gas; iii) a plurality of sets of outlet conduits, each set of outlet conduits being in fluid communication with the at least one inlet conduit and having a plurality of outlets for directing the gas out of the outlet conduits. The respective outlets of the sets of outlet conduits are arranged in a direction along the housing surface and away from a center region relative to the respective sets of outlet conduits, so that a laminar gas flow that flows along the housing surface generates a pressure differential which creates a force towards the center region to hold the object against the housing surface.

Transfer device for holding an object using a gas flow

A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

Apparatus for increasing coverage of shielding gas during wire bonding

A transducer is provided that comprises a horn having a longitudinal axis, a bonding tool attached to the horn, and an ultrasonic generator attached to the horn and spaced from the bonding tool along the longitudinal axis of the horn. A flexure is attached to the horn between the bonding tool and the ultrasonic generator for supporting the horn whereby to increase its dynamic rigidity in directions transverse to the longitudinal axis.

Transducer and method for mounting the same

A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.

Molding apparatus incorporating pressure uniformity adjustment

An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet positionable adjacent to the first die is configured to project a hot gas onto bond pads of the first die for bringing the bond pads to a desired bonding temperature, thereby rapidly heating the first die for effective wire bonding.

Forced heat transfer apparatus for heating stacked dice

A bonding apparatus such as an ultrasonic transducer is provided that comprises an oscillation amplification device having a longitudinal axis and a substantially triangular cross-sectional area on a plane that is orthogonal to the longitudinal axis. An ultrasonic driver is coupled to the oscillation amplification device at a first position along the longitudinal axis and a bonding tool is mounted to the oscillation amplification device at a second position along the longitudinal axis spaced from the first position.

Bonding apparatus comprising improved oscillation amplification device

A support structure supporting a movable component is provided with a vibration damper in the form of at least one cavity in the structure, the cavity being filled with a composite material; preferably a composite material of about 80% butyl rubber and 20% carbon particles. The composite material is preferably bonded to the cavity walls by adhesive or mechanically coupled by a texture on the cavity walls. The rubber composite may be first moulded then inserted into the cavity or may be injected into the cavity and moulded by the cavity. The cavities may be provided with a vent to facilitate insertion or injection of the composite material.

Passive damping of vibrations in a support structure

A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free distal ends between which a wedge is inserted to open the passage to allow the tool to be inserted into, or removed from, the tool holder. The arms may be covered by protective walls, in which case an end wall is provided with an aperture to allow the wedge to access a slot between the arms.

Growing community of inventors

Singapore, Singapore

Sathish Kumar Balakrishnan