Maxim Integrated Products, Inc.

Satbir Madra

Kumar Nagarajan

Kai Chieh Liu

Yi-Sheng Anthony Sun

Yong L Xu

Xiansong Chen

Embedded die packages are described that employ one or more substrate redistribution layers (RDL) to route electrode nodes and/or for current redistribution. In one or more implementations, an integrated circuit die is embedded in a copper core substrate. A substrate RDL contacts a surface of the embedded die, with at least one via (e.g., thermal via) in contact with the surface RDL to furnish electrical interconnection between the embedded die and an external contact. Additional substrate RDL or WLP RDL can be incorporated into the package to provide varying current distribution between the embedded die and external contacts.

Embedded die redistribution layers for active device

A semiconductor package device, electronic device, and fabrication methods are described that include at least one sacrificial contact pad as a portion of the semiconductor package device for preventing and reducing stress on the semiconductor package device and increasing board level reliability. In implementations, the semiconductor package device includes a lead frame substrate including at least one lead frame contact pad and at least one sacrificial contact pad, an integrated circuit device electrically coupled to the lead frame substrate, and an encapsulation layer that encapsulates the lead frame substrate and the integrated circuit device. In implementations, one process for fabricating the semiconductor package device includes placing an integrated circuit device on a lead frame substrate, where the lead frame substrate includes at least one lead frame contact pad and at least one sacrificial contact pad, and encapsulating the integrated circuit device and the lead frame substrate with an encapsulation layer.

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Santa Clara, CA, United States of America

Satbir Madra