Applied Materials, Inc.

Novellus Systems Incorporated

Superbrewed Food, Inc.

Other

Intel Corporation

White Dog Labs, Inc.

Sasson Roger Somekh

Dan Maydan

Manoocher Birang

John M White

Harry Q Lee

David K Cheng

Robert D Tolles

Ilya Perlov

Eugene Gantvarg

David N Wang

Norm Shendon

Kevin P Fairbairn

Mei Yin Chang

Fred Conrad Redeker

Shijian Li

Shamouil Shamouilian

John F Cameron

Lawrence M Rosenberg

W George Faraco, Jr

Gary M Kolstoe

Gregory W White

Liang-Yuh Chen

Christopher F Lane

Robert B Lowrance

Ratson Morad

Aharon Eyal

Masato M Toshima

Howard E Grunes

Bryan Patrick Tracy

Lance S Reinke

J Christopher Moran

Richard A Seilheimer

Isaac Harari

Peter D Hoppe

Kenneth S Collins

Steven M Zuniga

Hung Chih Chen

Steven Verhaverbeke

Hiroji Hanawa

Ashok K Sinha

Jun Zhao

Wei-Yung Hsu

Lawrence C Lei

Phillip R Sommer

Jaim Nulman

Chien Chiang

Hyman J Levinstein

Charles N Dornfest

Semyon Sherstinsky

Talex Sajoto

Cissy S Leung

Daniel A Carl

Jerry Yuen Wong

Chandra V Deshpandey

Leonid Selyutin

Donald M Mintz

Bret W Adams

Norman Shendon

J Kelly Truman

Boris T Govzman

Vladimir J Zeitlin

Dana L Andrews

Kenneth R Stalder

Debabrata Ghosh

Ron Northrup

Zheng Xu

John C Forster

Feng Quan Liu

Avi Tepman

Dennis Michael Hausmann

Majeed Foad

Barry Lee Chin

Yan Wang

Vincent W Ku

Wai-Fan Yau

Amir Hamed Al-Bayati

Roderick Craig Mosely

George D Papasouliotis

Alain Duboust

Hari K Ponnekanti

Yoram Uziel

Rashid Mavliev

Yongqi Hu

Babak Adibi

Bunsen B Nie

Adrianne K Tipton

Marc O Schweitzer

Philip M Salzman

Brian Lu

Raihan M Tarafdar

Jeff Tobin

John Randall Phillips

Timothy Mark Archer

Frank P Chang

Shawn William Jones

Kelly A Colborne

Po Tang

Daniel Knox Mitchell

Amotz Maimon

Dale A Monceaux

Provided is food component comprising cells of at least one bacterium, said cells comprising a crude protein concentration of at least 60 wt % of a total dry weight of said cells and nucleic acid at a concentration of less than about 5 wt % of a total dry weight of said cells, wherein at least 50% of a total number of said cells are dead cells. Further provided are food and beverages comprising such food components and methods of manufacture thereof.

Food components having high protein content

Provided are aqueous fermentation feedstocks comprising glucose monomers at a concentration of less than 50 gram/Liter (g/L) of the total feedstock, water-soluble dextrose oligomers at a concentration in a range between 50 g/L and 300 g/L of the total feedstock; and water. Further provided are methods of production thereof and uses thereof in the production of single cell protein and/or ethanol.

Starch aqueous fermentation feedstock and a method for the production thereo

Integrated mixotrophic fermentation method comprising (i) an isolated naturally acetogenic organism; (ii) a first feedstock comprising a carbon source for use in a fermentation medium; (iii) a second feedstock comprising elemental hydrogen for use in the fermentation medium; wherein the second feedstock comprises performing electrolysis; and (iv) culturing the organism in the fermentation medium, whereby both feedstocks are metabolized and a fermentation broth is formed, which broth comprises at least one bioproduct.

Integrated mixotrophic fermentation method

A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

A method of a single wafer wet/dry cleaning apparatus comprising:

Method and apparatus for processing a wafer

Conformal nanolaminate dielectric deposition and etch back processes that can fill high aspect ratio (typically at least 5:1, for example 6:1), narrow width (typically sub 0.13 micron, for example 0.1 micron or less) gaps with significantly reduced incidence of voids or weak spots involve the use of any suitable confirmal dielectric deposition technique and a dry etch back. The etch back part of the process involves a single step or an integrated multi-step (for example, two-step) procedure including an anisotropic dry etch followed by an isotropic dry etch. The all dry deposition and etch back process in a single tool increases throughput and reduces handling of wafers resulting in more efficient and higher quality nanolaminate dielectric gap fill operations.

Conformal nanolaminate dielectric deposition and etch bag gap fill process

Methods are provided for forming a circuit component on a workpiece substrate. The methods comprise the steps of depositing a dielectric material over the substrate; etching a pattern through the dielectric material to expose a portion of the substrate; depositing a barrier metal over the dielectric material and the exposed portion of the substrate; depositing a conductive metal over the barrier metal, the deposited conductive metal having a thickness sufficient to fill the etched pattern; planarizing the conductive metal to form a planar metal layer; and polishing the metal layer and the barrier metal in a single polishing step using an abrasive-free polish until the dielectric material surrounding the pattern is exposed.

Method of forming a damascene structure with integrated planar dielectric layers

A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc. During the deposition, the partial enclosure and the substrate are rotated relative one another.

Integrated multi-step gap fill and all feature planarization for conductive materials

A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.

Chemical mechanical polishing apparatus with rotating belt

A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.

Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing station is located between either two polishing stations or between a polishing station and a transfer station. Multiple carrier heads are supported by a support member that is rotatable about an axis. The transfer station and the multiple polishing stations are arranged at approximately equal angular intervals about the axis.

Polishing apparatus having a trough

Methods, systems, and mediums of controlling a semiconductor manufacturing process are described. The method comprises the steps of measuring at least one critical dimension of at least one device being fabricated on at least one of the plurality of wafers, determining at least one process parameter value on the at least one measured dimension, and controlling at least one semiconductor manufacturing tool to process the at least one of the plurality of wafers based on the at least one parameter value. A variation in the at least one critical dimension causes undesirable variations in performance of the at least one device, and at least one process condition is directed to controlling the processing performed on the plurality of wafers. The at least one manufacturing tool includes at least one of an implanter tool and an annealing tool.

Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements

Growing community of inventors

Los Altos Hills, CA, United States of America

Sasson Roger Somekh