Alphabet Energy, Inc.

Noren Products Inc.

Sasi Beera

Matthew L Scullin

Sravan Kumar R Sura

John P Reifenberg

Lindsay M Miller

Adam Lorimer

Dennis Galindo

Douglas Crane

Rahul Mulinti

Sanchan Modi

Heat exchanger assemblies and methods are provided for cooling the interior of an enclosure (e.g., electrical cabinets, computer server racks, chemical chambers, and animal cages). Heat is transferred via thermal conduction from a first plurality of surfaces positioned inside the enclosure to a second plurality of surfaces positioned outside the enclosure. The first and second plurality of surfaces remain in thermal contact with one another during use. Heat is dissipated from the second plurality of surfaces to the ambient air outside the isolated environment without the ambient outside air mixing together with the air inside the enclosure. This, in turn, inexpensively removes heat from the air inside the enclosure and prevents contaminants from entering the enclosure.

Methods for cooling the interior of an enclosure

Heat exchanger assemblies and methods for cooling the interior of an enclosure

A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.

Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same

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Fremont, CA, United States of America

Sasi Beera