Intel Corporation

Rockwell Collins, Inc.

Other

Sasha N Oster

Adel A Elsherbini

Georgios C Dogiamis

Telesphor Kamgaing

Johanna M Swan

Feras Eid

Aleksandar Aleksov

Shawna M Liff

Thomas L Sounart

Brandon M Rawlings

Valluri Ramana Rao

Richard J Dischler

Baris Bicen

Amit S Baxi

Braxton L Lathrop

Vincent S Mageshkumar

Nadine L Dabby

Sarah Kay Haney

Erich Nolan Ewy

John Stephen Guzek

Emanuel Cohen

Kyu Oh Lee

Debendra Mallik

Henning Braunisch

Kemal Aygun

Omkar G Karhade

Islam A Salama

Weng Hong Teh

Joshua Heppner

Charles A Gealer

Timothy E McIntosh

Nitin A Deshpande

William J Lambert

Fay Hua

Veronica Aleman Strong

Kenneth D Shoemaker

Carlos J Chavez

Gaurav Chawla

Jonathan A Lovseth

Christopher J Nelson

Kumar Ranganathan

Wen-Ling Huang

Tyler N Osborn

Ian A Young

Robert L Sankman

James B West

Lakshman Krishnamurthy

Vijay K Nair

James Chris Matayabas, Jr

Yoshihiro Tomita

Javier Soto Gonzalez

Ravi V Mahajan

Srikant Nekkanty

Tak Ming Mak

Jin Yang

Abram M Detofsky

Nader N Abazarnia

Vadim Olen

Michael C Rifani

Tannaz Harirchian

Chukwunenye S Nnebe

Aranzazu Maestre Caro

Zheng Zhou

Robert J McCabe

Taesha Diggs Beasley

Jelena Culic-Viskota

Tom L Simmons

Lay Wai Kong

Racquel L Fygenson

Yoko Sekihara

Christopher Routh

In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

Semiconductor packages with antennas

A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

Methods for conductively coating millimeter waveguides

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

A receiver system for correlating one or more signals (beam patterns) is disclosed. One or more antenna elements are configured to receive the signals. A controller generates correlator outputs based on a first set of duplicated signals, generates a first set of beams based on the one or more correlator outputs using a first beamforming module, generates a second set of beams based on a second set of duplicated signals using a second beamforming module, generates one or more power estimates based on the second set of beams, and divides each of the first set of beams by a corresponding power estimate to generate one or more normalized correlations.

Technique for post-correlation beamforming

Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

Semiconductor package including a modular side radiating waveguide launcher

A multi node radar network system is disclosed. The system includes a base node configured to transmit a directional 5G RF signal, a request node configured to request the base node to transmit the 5G RF signal, and one or more listening nodes configured to receive reflections of the 5G RF signal off of a target object. The system further includes a computation module configured to determine the location of the target object from data received from at least one of the base node, the request node, or the one or more listening nodes. A method for determining the position of a target object in a multi node radar system is disclosed.

Multistatic radar utilizing 5G

Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

Mmwave dielectric waveguide interconnect topology for automotive applications

A spread-spectrum transmitter is disclosed. The transmitter includes a modulator configured to produce an intermediate frequency signal, a frequency shifter configured to shift the intermediate frequency factor by a first factor, and a local oscillator (LO) configured to generate a LO signal. The transmitter further includes a ramp signal generator configured to determine the value of the first factor and a second factor, is configured to transmit the value of the factor to the frequency shifter, is configured to transmit the value of the second factor to the LO, where the frequency of the intermediate frequency signal shifted by the first factor is shifted synchronously with the frequency of the LO signal shifted by the second factor. The transmitter includes a mixer configured to mix the shifted intermediate frequency with the shifted LO signal that has been shifted by the second factor, producing a spread leaked LO signal.

Fast local oscillator tuning transmitter

Embodiments include a sensor node, an active sensor node, and a vehicle with a communication system that includes sensor nodes. The sensor node include a package substrate, a diplexer/combiner block on the package substrate, a transceiver communicatively coupled to the diplexer/combiner block, and a first mm-wave launcher coupled to the diplexer/combiner block. The sensor node may have a sensor communicatively coupled to the transceiver, the sensor is communicatively coupled to the transceiver by an electrical cable and located on the package substrate. The sensor node may include that the sensor operates at a frequency band for communicating with an electronic control unit (ECU) communicatively coupled to the sensor node. The sensor node may have a filter communicatively coupled to the diplexer/combiner block, the transceiver communicatively coupled to the filter, the filter substantially removes frequencies from RF signals other than the frequency band of the sensor.

Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars

Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

Microelectronic package communication using radio interfaces connected through wiring

An electromagnetic channel emulator system is disclosed. The system includes an electromagnetic switch matrix sub-system communicatively coupled to one or more systems under test and one or more simulation control layers. The system may include a high performance computing layer including one or more processing element nodes. The electromagnetic switch matrix sub-system may include one or more electromagnetic systems under test input/output layers and one or more high performance computing input/output layers. The one or more input/output layers may include one or more signal converters. The electromagnetic switch matrix sub-system may include one or more switches communicatively coupled to the one or more input/output layers and the high performance computing layer. The one or more switches may be configured to selectively position the one or more analog signals based on the received one or more simulation control layer signals.

Electromagnetic (EM) channel emulator system

Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

Mmwave waveguide to waveguide connectors for automotive applications

Growing community of inventors

Chandler, AZ, United States of America

Sasha N Oster