Corning Incorporated

Corning Incorporation

Sasha Marjanovic

Garrett Andrew Piech

Robert Stephen Wagner

Sergio Tsuda

Albert Roth Nieber

Stephan Lvovich Logunov

Shyamala Shanmugam

Dana Craig Bookbinder

Pushkar Tandon

Nicholas Francis Borrelli

Michael Edward Badding

Natesan Venkataraman

Kamjula Pattabhirami Reddy

Helmut Schillinger

Carlos Alberto Pons Siepermann

Zsigmond Varga

Linda Ruth Pinckney

Dell Joseph St Julien

Timothy James Orsley

David Andrew Pastel

Kristopher Allen Wieland

Thomas Hackert

George Halsey Beall

Robert Michael Morena

Gregory A Merkel

Xinghua Li

Joseph Francis Schroeder, Iii

James Gregory Couillard

Melinda Ann Drake

Lisa Ann Lamberson

George Bigelow Hares

Jonathan David Pesansky

David John McEnroe

James Joseph Watkins

Katherine Rose Rossington

Jose Mario Quintal

Ralf Joachim Terbrueggen

Ming Ying

Moussa N'Gom

Daniel Schnitzler

Vytautas Sabonis

Jason Roy Grenier

Reinhard Moritz Malchus

Andrea Nichole Yeary

Carlos A Pons Siepermann

Bertrand Paris

Valdemaras Juzumas

Carlos Pons Siepermann

A method of laser bonding glass to metal foil includes contacting a first glass substrate with a first metal foil to create a first contact location; directing a laser beam on the first contact location to bond the first glass substrate to the first metal foil; contacting a second glass substrate with a second metal foil to create a second contact location; and directing the laser beam on the second contact location to bond the second glass substrate to the second metal foil, wherein the first metal foil and the second metal foil each have a thickness from 5 μm to 100 μm, and wherein the laser beam comprises a pulsed laser comprising: a pulse energy from 2.8 μJ to 1000 μJ; and a wavelength such that the first and second glass substrates are substantially transparent to the wavelength.

Laser bonding of glass to thin metal foil

A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tof 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater.

Methods for laser processing transparent workpieces using modified pulse burst profiles

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of &#x3e;0.25 m/sec, to cut sharp radii outer corners (&#x3c;1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 5-15 microns.

Laser cutting and processing of display glass compositions

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Method for rapid laser drilling of holes in glass and products made therefrom

The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a COlaser (coupled with high pressure air flow) for fully automated separation.

Laser cut composite glass article and method of cutting

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

Edge chamfering methods

A gas permeable glass window, suitable for use with liquid interface additive manufacturing, has an optically transparent glass article greater than about 0.5 millimeters in thickness defining a first surface and a second surface. A plurality of gas channels are disposed through the article from the first surface to the second surface. The gas channels occupy less than about 1.0% of a surface area of the article and are configured such that the article has a gas permeability between about 10 barrers and about 2000 barrers.

Gas permeable window and method of fabricating the same

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a COlaser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or COlasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla&#xae; glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a COlaser for fully automated separation.

Processing 3D shaped transparent brittle substrate

A display device having a display element, such as a light-emitting device or a light-reflecting device, such as a MEMS device, and a glass touch panel covering the display element, the outer surface of the panel being textured. The panel is thin, having a thickness of 1.1 mm or less between the inner and outer surfaces.

Display device with light diffusive glass panel

The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a COlaser beam to promote full separation about the perforated line.

Laser processing of slots and holes

A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

Laser processing of sapphire substrate and related applications

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Painted Post, NY, United States of America

Sasha Marjanovic