Institute of Microelectronics

National Semiconductor Corporation

Sarvotham M Bhandarkar

Tai Chong Chai

Kishore Kumar Chakravorty

Jian Hua Wu

Subodh Gautam Mhaisalkar

Ai Min Tan

Bernard K H Lee

Emillo F Mallare, Jr

Ben T C Tan

Improved structures for and methods for assembling heatspreader attachments in integrated circuit packages permit attachment of a relatively low cost heatspreader having a high coefficient of thermal expansion directly to the back of a die while maximizing thermal performance, mechanical integrity and reliability of the assembly. The improvements are realized through the use of specific adhesive materials to attach the heatspreader to the die, heatspreader geometries, adhesive geometries, assembly techniques and underfill geometries.

Method and structure for heatspreader attachment in high thermal performance IC packages

A dispenser contains a chamber enclosed by an upper wall and a lower wall, both walls are oriented parallel to each other. The upper wall has a vertically bored inlet port and the lower wall has a plurality of vertically bored outlet ports for providing access to the chamber. The outlet ports are geometrically arranged in an array pattern characterized by equidistantly spaced rows and columns of bores. There is a plurality of baffle plates interposed between the upper wall and the lower wall. The baffle plates, which are spatially separated from each other, are oriented parallel to and spatially separated from the upper and lower walls. The baffle plates have a plurality of vertically bored holes for providing access between the inlet port and the outlet ports, whereby the dispenser is effective in providing homogeneous flow of fluid through the outlet ports.

Apparatus for dispensing fluid in an array pattern

Growing community of inventors

Singapore, Singapore

Sarvotham M Bhandarkar